Electronics Forum | Wed Feb 28 21:42:56 EST 2007 | davef
Very smart, Chunks.
Electronics Forum | Tue Jul 19 11:52:24 EDT 2016 | oleksz
Thank you Pavel. Aleksander
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Tue Feb 27 20:53:10 EST 2007 | davef
We'll guarantee the two pads are too close together. The proper spacing depends on the orientation of the parts to the wave. * Do the pads hit the wave at the same time? * Does one pad hit the wave before the other? If so, which? * How does the 06
Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina
I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/
Electronics Forum | Wed Feb 23 18:57:58 EST 2000 | Mike Vina
I don't know if this is the real answer you are looking for, but the EIA-625 and EIA-583 standards may provide you with the depth. http://www.jedecstandards.com/
Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks
Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem
Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris
Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A
Electronics Forum | Sun Oct 09 11:16:06 EDT 2016 | mekmat
Hello, I would like to ask you about the minimal distance between components and border of pcb especially V-cut to avoid crack of component during depaneling? I need some standard (IPC or something) where is this defined? Thank you for your support
Electronics Forum | Wed Sep 02 15:02:36 EDT 2020 | SMTA-64387501
We have recently received some pre-tinned "flat lead packages" and the question I have relates to the definition of solder touching the component body of the part. Typically when I have gold lead parts tinned there is a gold gap between the tinned po
