Electronics Forum | Thu Jul 18 16:53:08 EDT 2013 | ejurentkuff
Our biggest concern is "head in pillow". I need something that can easily find this defect and call it out. I don't want something that I need an operator reviewing for pass/fail.
Electronics Forum | Wed Oct 17 09:59:12 EDT 2018 | dnachristen
That's incorrect. 3D aoi is extremely useful for determining solder flow and slope which a 2D can't do. Yes it's also great for coplanarity, tomb stoning, head and pillow and a multitude of other defects. Most 3d AOI use cad models and height measure
Electronics Forum | Mon Feb 16 12:33:58 EST 2015 | ianatvadatech
Hey Syed, I've been running the MV-9 for just over a year. We shopped around very extensively (two APEX shows) before switching from yestech to mirtec and we bought two of the best systems they had to cover the four lines we run. Two systems are fa
Electronics Forum | Tue Jul 07 05:55:34 EDT 2009 | kpm135
I agree with your assessment of the two pins with irregular solder. The head-in-pillow or broken joint are both probable events for your defect. At this point in the process it will probably be difficult to pinpoint the exact cause. If it was a broke
Electronics Forum | Thu Apr 27 08:42:22 EDT 2017 | pvasquez
Hello M. We are a low volume high mix manufacturer with a total of 7 Mirtec AOI machines including a new MV-6 OMNI 3D system. I am very pleased with this machine! When we did our 3D AOI research, my team narrowed the field down to 2 vendors, Mirt
Electronics Forum | Thu Apr 03 17:39:37 EDT 2014 | siddharth
You are correct. Both the machines are "semi-automatic". The program can focus on the part you want to inspect and perform basic inspections like void analysis (BGA, QFP) etc. But you have to manually navigate and look for defects like TH solder fill
Electronics Forum | Tue Nov 14 21:27:26 EST 2006 | davef
"Hidden pillow" seems to be a a variant of "pillow effect" or "head in pillow". Pillow effect is an open, with non-wetting between the lead and the solder on the pad. Here the lead sags into the solder without any bonding or wetting. Poor wetting c
Electronics Forum | Fri Nov 22 11:31:52 EST 2013 | igorfo
Hi I aa QE on SMT line that produce products for Home introduction. No so long ago we have a problem with soldering of BGA Head on Pillow (root cause mismatching customer requirements and BGA profile spec, suplier change %Ag) and our product affect
Electronics Forum | Thu Apr 14 13:24:18 EDT 2016 | davef
I doubt that your problem is driven primarily by irregularities in your circuit board. My bet is that you’re seeing defects caused primarily by the warpage in your LGA. Consider using advice often given for minimizing warpage caused defects in BGA
Electronics Forum | Fri Apr 13 10:13:30 EDT 2007 | Bob R.
We had a crisis with one BGA causing huge yield losses due to this defect. Nothing we could do with the profile got rid of it. Changing paste didn't get rid of it. It was the BGA warping in reflow, caused the corners to lift up when the solder was