Electronics Forum | Mon Oct 21 12:18:22 EDT 2002 | John S
We're looking at a new assembly that will require an SMT heat sink. Can anyone recommend potential vendors for this part? It is new to us, so we're having to start from scratch. Thanks John
Electronics Forum | Sun Aug 01 11:27:40 EDT 2004 | haran
What is the best epoxy attachment method for Heat Sink?The operator always miss the solvent dispensing application prior to epoxy dispense which cause the heatsink falling off at customer site as well as in the factory?Any advise?
Electronics Forum | Fri Mar 24 14:06:07 EST 2006 | mdemos1
Hi. We are designing in a 128 pin LQFP that has a heat sink in the center of the package. The size of this is 7.44 by 7.55 mm. Can anyone recommend what pad size should be on the board for this? How about stencil aperture/pattern? Thanks, Mike.
Electronics Forum | Fri Mar 19 18:07:24 EDT 2010 | davef
That's how it's supposed to work, but is working correctly on the components that are loosing heat sinks for you? We have two choices: * Poor solderability of either the component or the heat sink ... OR * Wrong solder preform material
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner
I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei
Electronics Forum | Wed Oct 10 12:22:08 EDT 2001 | Kevin
Cal, There are several suppliers of cover tape materials that do not require heat to activate the adhesive. 3M and Advantek are likely the leaders. There are relatively few T&R machines that can handle both heat and non-heat applications - as Chri
Electronics Forum | Wed Jun 05 21:33:12 EDT 2002 | davef
Tough to say based on what you have told us. Things to Determine are: * Is the heat at the solder connections that are not reflowing properly adequate? * Is the pad surface of the solder connections that are not reflowing properly solderable?
Electronics Forum | Wed Sep 25 13:38:35 EDT 2002 | finepitch
Yannick, If we leave the 201 issue aside; have you checked where those BGA pads are connected to? Could those be power/ground balls connected to large (difficult to heat up) planes by any chance? Erhan
Electronics Forum | Thu Oct 11 13:37:35 EDT 2001 | Stefan
The pressure sensitive tape is used as an alternative to heat sealed cover tape. It works usually quite well and is easily applied by the taping machine, but it can create some problems in the tape feeder. In the Surftape, Cal is referring to, the c
