Electronics Forum | Tue Jun 20 00:31:18 EDT 2006 | Frank
I, too, would bend it 90-degrees prior to assembly and I would also put on a little spring loaded, removable, heat sink on to the wire to stop the heat transfer up the wire. After the wire is soldered, then remove the heat sink. Try the one from Ra
Electronics Forum | Wed Sep 24 11:07:36 EDT 2003 | davef
We use the clips for our heat sink supplier.
Electronics Forum | Wed Mar 07 07:21:08 EST 2007 | jdengler
We window pane the heat sink pad to reduce the amount of paste for DPACK component
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Wed Feb 16 05:00:50 EST 2000 | Dean
What is the package type? TO92, TO5...etc. This temp. sensing device clips (mechanically) to the sink. And this requires a special tool? How about thermo bond heat sink compound? "output" by loc tite is the only flavor I can think of...There a
Electronics Forum | Thu Jun 17 20:57:44 EDT 1999 | Earl Moon
| Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assembl
Electronics Forum | Tue Jul 14 13:23:59 EDT 1998 | Tom
I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. General
Electronics Forum | Fri Jun 06 18:44:26 EDT 2003 | davef
No, no. It's koscher to have thermal planes. You just need to: * Work with your fabricator to keep the layup balanced. * Relieve the plane so that it doesn't cause assembly problems. While probably not directly for your part, it gives a starting p
Electronics Forum | Thu Mar 12 21:14:16 EDT 2009 | davef
Mask: * I/O connector contact surfaces * Bus connector contact surfaces * Configuration jumper blocks * Test points * Surfaces that contact heat sinks (heat sinks are removed prior to coating) * Board mounting holes * Adjustable potentiometers * P
Electronics Forum | Fri Mar 04 01:08:19 EST 2011 | kemasta
Thanks davef Bridging:- There is no heat sink on the BGA, the heat sink will be fix after relow. I do believe paste had something to do with it, but currently this defect didn't appear so oftenly, so we think that the main root cause is not from the