Electronics Forum: hi--we (Page 3 of 48)

Re: This is Bogus

Electronics Forum | Thu Sep 09 09:40:41 EDT 1999 | Dave F

| | | Cunli | | You have done one Hell of a job here, good luck to you, stop in and say hi (we would love to here from you). | | MDCox | | Ya know, it is ... why doesn't Peter come-up with something to keep Cunli on the job? My2� Dave F

Solder ball bridging under BGA

Electronics Forum | Wed Sep 02 06:50:55 EDT 1998 | Masdi Muhammad

Hi, We are having problem with yield loss due to electrical fail. Further investigation shows that the failure is due to solder bridging under BGA. Has been there any study or experience on how this could occur and what we can do to prevent it. Than

DOUBLE REFLOW WITH HEAVY WEIGHT PLCC PACKAGE

Electronics Forum | Thu Jul 23 21:27:35 EDT 1998 | Stoney Tsai

Hi, We have encountered one serious problem that heavy packages falling down during second side reflow, especially for PLCC 84. I believe it caused by temperature profile setting. Any good suggestion would be highly appreciated! Stoney Tsai

Removal of No-Clean flux residue

Electronics Forum | Fri Sep 07 21:43:40 EDT 2001 | mugen

Hi, We use IPA and Prozone, if IPA is so drastically detrimental, to the pcba's.....what suggested alternative, can you please recommend, as IPA replacement? Thanks.

Stencil Cleaner

Electronics Forum | Wed Mar 27 22:32:18 EST 2002 | ericchua

Hi, We have a Cleaing machine which is Germany product. This cleaning machine is using water base (detergent) and is a spray type. You can visit our web-side at http://www.cyberfurn.com.sg for more information.

Silver Pladium coating

Electronics Forum | Wed Oct 02 00:08:26 EDT 2002 | praveen

Hi, We are using chip components with Silver Pladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how ti improve the solder wetting for those components. Thanks,

Silver Paladium coating

Electronics Forum | Wed Oct 02 00:08:39 EDT 2002 | praveen

Hi, We are using chip components with Silver Paladium coating and finding poor wetting. We are using the water wash solder paste with 2Ag and std. reflow profile. Any suggestion how to improve the solder wetting for those components. Thanks,

Fine pitch paste release problems.

Electronics Forum | Mon Dec 16 21:35:46 EST 2002 | grantp

Hi, We tried AIM no clean, and one other paste which I cannot remember the name offhand. We have been using Koki lately, and that's been the best. It seems to leave less residue behind in the stencil. Regards, Grant Petty Blackmagic Design

TOMBSTONE DEFECTS

Electronics Forum | Sat Mar 15 00:52:18 EST 2003 | Grant

Hi, We had tomb-stoning on a product, and it was quite severe. We eliminated it by reducing the amount of solder paste on the small passible component pads. We used a 5 thou stencil, with 20% reduction, and it eliminated the problem. Regards, Gra

Stencil alignement using the 2 cameras

Electronics Forum | Tue Apr 15 13:51:56 EDT 2003 | fpcb

hi, we used to place SMDs with adhesive and wave solder machines. Now we try to work with an old stencil printer that we have ane then reflow, and we have no experience.Can anyone tell us by which method stencils are aligned using the 2 cameras of th