Electronics Forum: hot-air (Page 3 of 56)

Re: Hot Air Nife

Electronics Forum | Wed Apr 28 16:49:47 EDT 1999 | Tony A

| | Anyone using hot air nife for wave soldering process. | | Does it work? | | Does it really eliminate solder bridging and does it create any other problems? | | | | any feed back will be much appriciated. | | | | Thanks | | | | Tony A | | |

Re: Hot-Air Leveling.

Electronics Forum | Fri Jun 12 00:21:02 EDT 1998 | Scott McKee

| Hello, | Some time ago before I was a

Re: Hot-Air Leveling.

Electronics Forum | Fri Jun 12 00:15:44 EDT 1998 | Scott McKee

| Hello, | Some time ago before I was a

QFP rework

Electronics Forum | Thu Apr 01 12:32:16 EST 2004 | russ

Steve, why the fear of hot air?

SMT Glue

Electronics Forum | Tue Oct 24 18:56:38 EDT 2006 | GS

Try by using hot air (narrow nozzle) blasting the chip body until it gets released. Regards.....GS

QFN Rework

Electronics Forum | Fri May 23 12:34:19 EDT 2008 | rgduval

We've used hot-air guns in the past to rework QFN's and DFN's. Cheers ..rob

Nitrogen Generation Equipment ( reliability)

Electronics Forum | Wed Sep 24 13:00:41 EDT 2008 | wavemasterlarry

I bet some of the bloggers on this site - The Forum - could provide enough hot air for ya!

BGA soldering & BGA ball formation

Electronics Forum | Tue Nov 18 14:33:45 EST 2008 | stepheniii

Do you mean BGA reballing? If so, then not with a hot air gun.

Rework Equipment

Electronics Forum | Mon Feb 28 08:18:03 EST 2000 | Engineer

I'm currently researching new rework equipment, and was wondering if anyone had any recommendations. We currently have an older PACE hot air system that has had mixed results. It tends to overheat the board and IC. Is the IR any better, or has hot ai

Component Failure caused by Hot Air Knife

Electronics Forum | Wed Sep 20 15:51:19 EDT 2000 | John

We are considering retrofitting our Vectra wave soldering machine with a hot air knife. I've run our problem board on a machine with this option and it does seem to work; however, there is a concern of component failure due to thermal shock. Is thi


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