Electronics Forum: how and much and valor (Page 3 of 12)

Fuji Pick and Place Machines

Electronics Forum | Wed May 12 01:40:56 EDT 2004 | Grant Petty

Hi, Thanks for all the advice, and we are looking at everything we know of, but have not had much info back from anyone at Universal yet. We have been interested in their machines too and are going to go to a trade show before we decide. However I

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 22 17:48:48 EDT 2015 | aemery

It's your first line, go with established manufacturers. Whether new or used it ultimately comes down to does the tool do the job and how well is it supported (labor/parts) if it does break down. I am a former field eng. with Speedline and now run

New Pick and Place Operation

Electronics Forum | Tue Jan 17 05:02:33 EST 2006 | grantp

Hi, I was replying to this thread appearing suddenly. However I have run both machines, and I paid for them myself because I run my own company, and so the choices I made, I personally had to pay for. Also, anyone who's been on this forum for a whi

Re: Geometric Dimensioning and Tolerancing

Electronics Forum | Sun Jun 07 02:06:26 EDT 1998 | Earl Moon

| Earl, | As always, I am interested in what you have to say, but I am still a little vague on your application of ANSI Y14.5 as it relates to the manufacturability of an assembled printed circuit board. Are you implying that component placement coor

repeatabilty and measurement for quality

Electronics Forum | Mon Sep 10 17:52:30 EDT 2001 | mparker

Are you doing actual measurements of the dummy parts placements? or are you just doing a visual go/no go check? If doing actual measurements, be sure to use mil inch units of measure rather than mm. Mil will give you more accurate readings. mm force

New Pick and Place Operation

Electronics Forum | Fri Jun 04 08:25:06 EDT 2004 | Cal

OK I am game and will put some input here...I do like the Samsung machines for the price and they are easy to program. Another company you may want to look at is Essemtec. ESSEMTEC USA Glasboro, NJ 08028-1499 Steve Pollock Tel. 1/856 218 1131 Fax 1/

tape splicing pros and cons

Electronics Forum | Wed Sep 21 12:30:03 EDT 2005 | Rob

Hi Greg, We've used lots of machines over the years & seen lots of different tape related issues - the main one being snap off of the cover tape, usually due to too much glue, over entusiastic heat seal, or a feeder requiring maintainance. Also the

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

Solder Paste and fine pitch components

Electronics Forum | Tue Sep 17 15:03:33 EDT 2002 | ccross

I am working with fine pitch components (15-20 mil) and having soldering problems and would appreciate some opinions. 1) How much of an effect does pad size have on bridging? 2) How much of an effect does solder paste grain size have? What is the re

BGA dead bug pick and place

Electronics Forum | Tue Oct 29 05:22:38 EST 2002 | kent

Thankyou very much for the information. Another question, what are the difficulty of dealing with the larger ball and tighter pitch? What is size of the ball is consider large and how far the distance for pitch is consider tight? Currently I have


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