Electronics Forum | Fri Jan 22 14:31:14 EST 1999 | Dave F
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Sat Jan 23 07:08:54 EST 1999 | Graham Naisbitt
| I have boards coated with Humiseal 1B73. At a late point mfg. site we need to remove a series of 0603 resistors for optioning purposes. I have been trying to determine the fastest, easiest way to re-coat the pads after removal. Drying time of the c
Electronics Forum | Wed Feb 16 12:22:54 EST 2011 | duso02
Have you always used xylene? For our 1B73 we use nothing but 73 thinner from Humiseal or PGMEA at about 50/50 depending on the humidity.
Electronics Forum | Tue Mar 01 15:07:00 EST 2011 | dennisfo
Update on 1B73 bubbles, Changed over to a mixture of Humiseal 73 thinner with coating (25 sec on Zahn 2) observed a reduction in bubble formation (approx. 20%) but still present.
Electronics Forum | Thu Nov 19 05:18:37 EST 2009 | prodivegsr
Hi All, Recently we are working on the conformal coating process using Humiseal chemical 1B73 and thinner 521. Bubbles on component body/joints are seen after gone through the IR Reflow Oven. During the conformal coating, only tiny bubbles seen af
Electronics Forum | Sat Jul 09 08:18:10 EDT 2005 | jdumont
Try Ellsworth Adhesives. We have good luck with them getting 1B73 in here fast on most occasions. www.ellsworth.com ...and no I dont work for them or know anyone who does!
Electronics Forum | Mon Jun 25 11:55:47 EDT 2007 | ck_the_flip
I don't think THEY (Humiseal) know how their material cures. I have a data sheet from them for 1B73, and it says 24 hours at room temperature or 30 min. @ 170�F. We use our in-line oven mainly to dry the material and make it tack-free. You would
Electronics Forum | Mon Jun 25 12:23:15 EDT 2007 | davef
Once the HumiSeal conformal coating has been applied to the printed circuit board it is usually best to allow the material to reach a touch-dry stage, before heating the board to accelerate the cure schedule. This avoids potential problems such as bu
Electronics Forum | Wed Feb 16 12:47:58 EST 2011 | dennisfo
I've been here approx. 3 months. It was indicated that Xylene has alwas been used but it was never indicated that bubbles were not present in the past (ignored or touchup). I have a sample of Humiseal 73 thinner ordered for testing. We've been thinne
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