Electronics Forum | Fri Sep 27 15:24:17 EDT 2002 | davef
This is too painful. I think you should be much more clever [some might say deceitful]. Call your contract house: * Tell them you have a new ISO/IEC Flimeral requirement for process control documentation that has been laid on you by a VEEEERY impor
Electronics Forum | Wed Sep 29 06:20:14 EDT 2004 | Peppe
FengAng, I'm involved in similar activities on telecom products and we use as reference: MIL-STD-883E, JESD22, IEC-749. We have 2 climatic chamber to arrange a wide range of test, depending on customer use and/or specs. Based on that experience, we p
Electronics Forum | Wed Jan 11 08:27:35 EST 2006 | davef
MSK As GS told you in an earlier posting, J-STD-002 and IEC 68-2-69 describe methods and equipment for component solderability testing. Go get a copy of either one. The primary component solderability test methods are: * Dip and look method * Wett
Electronics Forum | Tue Oct 17 20:15:12 EDT 2006 | davef
In the past, black poly was used as a bridge between pink poly and shield bags because of slightly lower cost and offering some shielding as opposed to none with pink poly. However, as the price of shield bags continue to drop the usage of black poly
Electronics Forum | Mon Nov 19 06:06:28 EST 2012 | ericrr
Hi ENIAC That table is part of a mush bigger article I was putting together, and will post somewhere at this website soon, as a one stop complete information. The hold up was Electrolytics and Tantalums code is different but there is no way to t
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Mon Jun 04 10:13:48 EDT 2007 | patrickbruneel
Chris, This is probably one of the reasons medical equipment and implants are exempt from the directive. Below a quote from an article published by the medical device network. RoHS excludes medical devices (category 8) and monitoring and control i
Electronics Forum | Sat Feb 18 09:20:09 EST 2012 | davef
The 3-Tier PCB library concept was originally created by IEC (International Electromechanical Commission) in 1999 and introduced to IPC in 2000. The concept had to be created as a solution for high density packaging for hand held devices to ruggedize
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
