Electronics Forum | Thu Jan 15 09:40:47 EST 2004 | davef
Search the fine SMTnet Archives. For instance: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=24429 Do not get your hopes up about finding something to support your "leaching out of silver theory", though. * AgxSn IMC are disbursed ro
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Fri May 17 15:53:47 EDT 2002 | davef
Based on what you�ve said, comments are: * There is no reason not to expect a trace of Zn in your 85/15 Sn/Pb solderability protection, but Sn/Cu IMC are more prevalent than Zn. * Intermetallic growth and oxidation are very different materials proper
Electronics Forum | Tue Dec 30 21:14:22 EST 2003 | davef
You're thinking correctly. 80Au20Sn is incompatible with: * Sn/Pb * In/Sn * Sn/Pb/In * Sn/Pb/Bi Contact your solder supplier to obtain pictures of IMC.
Electronics Forum | Mon Feb 21 09:05:46 EST 2005 | davef
We're try to stay away from using electroless nickel. Please describe the differences between the IMC.
Electronics Forum | Wed Aug 24 08:54:30 EDT 2005 | patrickbruneel
SEM to determine thickness and spectrum analyses to determine the metals forming the IMC. This will give you everything you would want to know.
Electronics Forum | Wed Aug 24 16:30:48 EDT 2005 | davef
Optical microscope or SEM work fine. You say, "I have found out that the method of measuring intermetallic compound(IMC) formation is quite questionable." What's the issue?
Electronics Forum | Tue Nov 15 11:21:32 EST 2005 | davef
Which is it: * Wire bonds don't stick when bonded * Wire bonds fall off, or break during service
Electronics Forum | Mon Feb 06 09:17:35 EST 2006 | Cal Kolokoy
Mike did you have these SEM'd to be able to see the IMC's within the solder joint?
