Electronics Forum | Tue Jan 02 14:15:59 EST 2007 | realchunks
I have a new customer that has a print calling for 2oz. copper finish for top and bottom layers, and 1oz. copper finish for the inner 6 layers. Now, they also have a stack up depicting each layer and thickness. It shows the outer layers of copper b
Electronics Forum | Wed Dec 05 18:28:54 EST 2012 | cnotebaert
what type of part is this a micro BGA by chance? there is a mill spec (man I cant remember it right now), I'll get back to you! it provides acceptance criteria for chip/crack/gouges.... if it doesn’t expose the lead frame (inner workings of the devic
Electronics Forum | Fri Dec 01 12:56:33 EST 2017 | emeto
It seems that it will work with 5 mil stencil. To be safe use 4 mil if the rest of the design allows it. 10x20mil apertures for both rows. If you have bigger footprint in the corners, make bigger apertures there. For the ground plane, I would use ver
Electronics Forum | Thu Jul 20 11:53:34 EDT 2000 | John Thorup
Hi Dave The larger the gage number the smaller the inner diameter. There is a nice chart relating color code, gage, ID and OD in the EFD Catalog. They don't list a web address but their phone is 800/556-3484. Email me if a fax copy would help John
Electronics Forum | Tue Jul 25 20:32:00 EDT 2000 | Dave F
Thanks John. You�re correct. I�ve seen tables like that. poorly stated, what I was wondering was: * Is there a calculation that relates the gauge and the inner diameter ... OR * Is that relationship similar to wire gauge and wire diameter. I th
Electronics Forum | Mon Sep 27 13:04:22 EDT 1999 | Chuck B
I AM LOOKING FOR A HOUSE IN NEW ENGLAND AREA IF POSSIBLE BUT NOT NECESSARY, WHO ARE EXPERIENCED IN DOING MATERIAL ANALYSIS ON THE INNER END CAPS OF CERAMIC CAPACITORS. PLEASE ADVISE THANKS IN ADVANCE
Electronics Forum | Mon Sep 10 14:09:17 EDT 2001 | flipchip
Check out my web site "www.ape.com" I can remove the package from the board at 183c and never reflow the 90Pb/5ln/5Ag solder on the inner-connects. The unit you're looking for is the Chipmaster. Casey Best of Luck
Electronics Forum | Thu Jun 12 03:41:47 EDT 2003 | sanjeevc
Most of the tools that are available in the market eg.ERSAscope or something similar gives a fair idea about the outside rows only and in case the defect happens in the inner layers all these tools are useless.The best way is to use AXI but then its
Electronics Forum | Sun Jun 26 10:18:03 EDT 2005 | bobpan
Mike no longer is employed by Tyco. Also if i were a betting man......i would bet....that he doesnt know the quad 1000 inner workings toooo well.
Electronics Forum | Thu Apr 14 12:51:45 EDT 2005 | russ
Most likely this can be done if the board does not have any inner layer artwork. Are there schematics available? if so a design shop can basically re-design the board from these.
