Electronics Forum | Tue Dec 13 15:51:11 EST 2005 | Amol Kane
what part was this? was the high temp solder on the first level interconnect? why is the high lead solder being soldered with a SAC alloy?
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Wed Sep 02 17:29:51 EDT 1998 | Dave F
| How would you mount a surface mount chip onto Perf board? I am doing a project for school and one of the chips is a surface mount, but everything else fits in Perf board. Any suggestions? Thanks Matt: Here's one way to do it: 1 Get a hot glue