Electronics Forum: interconnect (Page 3 of 16)

BGA Device with Slanted and Damaged Spheres

Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS

I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,

Solder Bearing Flux Technology

Electronics Forum | Fri Apr 15 16:14:49 EDT 2005 | davef

Jim Zanolli of Teka Interconnect did an "OnBoard Forum" a couple of years ago [ http://www.smtnet.com/forums/index.cfm?CFApp=2&forum_idx=44 ]. He certainly would be a good point of contact.

How are you guys checking parts for RoHS compliance?

Electronics Forum | Tue Dec 13 15:51:11 EST 2005 | Amol Kane

what part was this? was the high temp solder on the first level interconnect? why is the high lead solder being soldered with a SAC alloy?

MID assembly

Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz

Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz

X-Ray Inspection of Plated PCB - Need Your Input

Electronics Forum | Thu Dec 17 03:20:32 EST 2009 | tod1967

Sounds like a good challenge. What is your interconnect bond method? Solder Paste, Pre-Form/Liquid Flux or Paste, Assuming your using solder. Reflow method?

3D - MID - automatic inspection

Electronics Forum | Fri May 27 07:14:21 EDT 2011 | janz

Hello, I am looking for companies which supply AOI for 3D - MID substrates. (MID- moulded interconnect devices). Regards Janz

Dye and Pry on PoPs?

Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet

Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

BGA Top Cap Detached after reflow Soldering

Electronics Forum | Sun Jun 12 09:29:41 EDT 2016 | davef

I'd guess that the interconnect pads on the BGA have poor solderability. Confirm this with testing at an independent lab. Work with your supplier to resolve the issue.

Re: Surface mount on perf board

Electronics Forum | Wed Sep 02 17:29:51 EDT 1998 | Dave F

| How would you mount a surface mount chip onto Perf board? I am doing a project for school and one of the chips is a surface mount, but everything else fits in Perf board. Any suggestions? Thanks Matt: Here's one way to do it: 1 Get a hot glue

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