Electronics Forum | Thu May 08 09:00:03 EDT 2003 | stefwitt
I like to find out more about your feeder manufacturer. Known problems: If the cover tape peel back is located in the pick up window, the tape may lift the component out of the pocket and when the component falls back it could be inverted. The co
Electronics Forum | Thu Nov 04 19:55:49 EDT 2010 | eadthem
The best method i have for the few lifted/bent lead issues we have is i use a ic/bridge inspector with all its default options to check for bridges and solder at the tip. then i add a solder inspector but this time accrost all pins at the downslope o
Electronics Forum | Fri Aug 03 19:03:32 EDT 2001 | seand
Hello John, What is the key reason requiring that this unknown material be injected from below vs. dispensed prior to placement. Is it an issue with reflow temperatures, effect on placement/thermal expansion? Is this a true requirement or specul
Electronics Forum | Wed Sep 26 11:59:26 EDT 2001 | mparker
Electrically, the part still works, even if upside down. When upside down, you cannot see the part identifier. If you are an OEM and your QA/QC people don't freak out because they can't read the part, let it go. If you're a CM, your customer would
Electronics Forum | Thu Aug 21 09:01:46 EDT 2003 | caldon
Dan- We here do double sided reflow: we place one side and reflow....place the other side and reflow. On the second flow the underside of the PCB- we will reduce the bottom side preheat. fortunatly for us the largest component we only place a 40pin P
Electronics Forum | Tue Aug 26 21:20:58 EDT 2003 | iman
You may check with the TDS of respective "active parts" IC manufacturers for their recommended no. of thermal cycles permissible in the reflow process. Last I checked 3 cycles for our RF-apps IC was still allowed. For 48pin-QFPs this can be allowed
Electronics Forum | Wed Jul 13 14:56:53 EDT 2005 | jdengler
I read the Cookson/Alpha paper "Optimizing stencil design for Lead-free SMT processing". I interpreted it to mean that if you had a mid chip solder ball (MCSB) problem the "radiused inverted home plate of 20/60/20 style" had the greatest impact on r
Electronics Forum | Wed Feb 01 22:27:16 EST 2006 | KEN
Many relays use soldered post coil terminatins inside the relay. In one case many years ago I found the SMT relay manufacturer used eutectic solder inside their hermetic relay. The SMT relay would fail because the solder balled up on the post, woul
Electronics Forum | Mon Mar 19 12:25:11 EDT 2007 | slthomas
This test nicely demonstrates the bond between parts and paste over time, but what about tack of paste on unpopulated boards? It seems she would also need to be testing by placing parts on boards that have been printed for 15 minutes, 30, 1 hour, 2
Electronics Forum | Wed Jan 07 09:38:22 EST 2009 | grayman
Hello, Electricity cost is getting high. May I know from you if you have �energy conservation� programs? Right now we implemented the following programs: Purchased an inverter type aircon system (office aircon turn off 30 minutes before going home),
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