Electronics Forum | Sat Oct 15 15:57:11 EDT 2005 | GS
Organic Solderability Preservative, is a definition that you can find, for istance, on IPC-2221A (geneiric standard on printed board design) Tabel 4-3 (Final Finisch, etc) Regards............GS
Electronics Forum | Wed Jul 06 20:40:40 EDT 2005 | davef
Voltage does not flow. Current flows as a result of a change in voltage. Current capacity of traces * Graph is IPC-2221 paragraph 6.2, Figure 6.4 * http://www.geocities.com/CapeCanaveral/Lab/9643/TraceWidth.htm
Electronics Forum | Fri Feb 02 08:22:10 EST 2007 | davef
Try: * IPC-2221, 5.4.3 Datum Features * http://www-ese.fnal.gov/ese-dfe/SMEMA%20fiducial%20mark%20standard.pdf
Electronics Forum | Wed Oct 07 11:42:02 EDT 2015 | davef
IPC2221 Generic Standard on Board Design talks about parts weighing 5 gm or more per lead shall be supported. And goes into detail that you can find there. I image much of the requirement for staking has to do with: * Weight of the component * Servi
Electronics Forum | Wed Apr 18 15:10:10 EDT 2018 | charliedci
If someone can find a RoHS specific standard I would be interested. IPC-2221 nor 2222 separate leaded from lead free (that I could see). Charlie
Electronics Forum | Thu Dec 05 08:32:56 EST 2019 | scotceltic
Thank you for the quick response. Can you tell me the exact verbage from IPC 2221B regarding via to via spacing ? I have Revision A and couldn't find anything that refers to this ? Thanks again for your help
Electronics Forum | Fri Aug 08 12:52:57 EDT 2003 | davef
So, if you give your customers design guidelines and one their products causes a cataclysmic explosion, resulting in the deaths and disfigurement of many handicaped third-world children, could a lawyer consider you responsible? Spec Fir Tree General
Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef
Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and
Electronics Forum | Mon Nov 08 14:18:10 EST 1999 | John Thorup
Reduced Oxide Soldering Activation is an electrochemical method of restoring the solderability of surfaces. Searching the archives of IPC technet and this forum will reveal more details. John Thorup
Electronics Forum | Tue Jun 03 01:50:10 EDT 2003 | jedduan
Hi Evtimov, You can get some information from IPC-SM-782A. Good luck! jed
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