Electronics Forum | Wed Jul 24 17:25:01 EDT 2019 | davef
Your solder stencil design should follow all basic rules for solder stencil design are followed in accordance with IPC-7525 including adherence to an area ratio of 2:3 or greater and an aspect ratio of 1.5 or greater.
Electronics Forum | Fri Jun 19 07:49:03 EDT 2020 | alanyang
Hope it's helpful for this stencil design.https://pcbboardassembly.com/how-to-understand-ipc-7525a-stencil-design-guidelines/
Electronics Forum | Tue Nov 21 15:49:01 EST 2000 | CAL
Dave- this may not be much current help but for future needs: IPC-7525 Stencil Design Guidelines is due out real soon. Check with IPC on its status, last I heard it was in interim Final.What is nice about this Doccument is that it also covers Pin_Thr
Electronics Forum | Thu Apr 12 09:50:51 EDT 2007 | pjc
There have been many designs of apertures for 0402, round, home plate, inverted home plate and various reduction amounts for square or rectangular apertures. What works best for a given application depends on PCB design, solder land finish, stencil t
Electronics Forum | Tue Jan 30 21:14:26 EST 2001 | davef
Suggestions are: * Limit pad width to 0.008" [0.2mm] * Use IPC-7525 Stencil Design Guidelines * Avoid Type 4 pastes, if you can * Slow down your print head to 0.63"/sec [16 mm/sec] * Consider the suggestions on printing by rpereira in the past
Electronics Forum | Tue Apr 03 13:27:58 EDT 2001 | mparker
go to http:\www.ipc.org. get the following standards: IPC-A-600F Also look at the IPC-6010 series, this may help with your design group. Finally, consider getting IPC-SM-782 and IPC-7525. These are for Surface Mount Design & Land Pattern Standards
Electronics Forum | Mon Dec 16 21:40:27 EST 2002 | grantp
Hi, Thanks for the info, and I will check it out. Do you know where the IPC 7525 spec is? Does it explain why square is better? I know there is some theory I am missing here, and that's why we have problems. I am just freaking out trying to establi
Electronics Forum | Mon Dec 12 16:08:37 EST 2005 | pjc
Here are some guidlines: http://www.tkb-4u.com/articles/printing/stencildesignguide/stencildesignguide.php www.indium.com/documents/applicationnotes/97742.pdf http://www.electronics.ca/standards/general/IPC-7525.html http://www.alphametals.com/pr
Electronics Forum | Fri Jan 12 07:00:27 EST 2007 | GDO
Hi guys, Pin in Paste guidelines will be included in the IPC-7525A "Stencil Design Guidelines". This draft is being reviewed now and is scheduled to be released by February, (March at the latest). There are many other sources for these guidelines
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
