Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Thu Sep 15 08:39:10 EDT 2016 | davef
J-STD-001 Revision F with Amendment 1
Electronics Forum | Fri Aug 24 11:03:15 EDT 2007 | hussman
I agree with Joris. But to add to his comment, the type of finish also has a direct affect to your wave solder process. Going from a gloss finish to a matte finish may help a lot. As for humidity affecting your wave - I doubt it. I use a water
Electronics Forum | Fri Sep 26 12:57:09 EDT 2003 | Angie
We have had some components that popped off in our IR oven. It was attributed to the solder paste. The humidity was above 60% the temp was about 70 degrees.
Electronics Forum | Fri Aug 24 09:29:08 EDT 2007 | jgrootkoerkamp
Solder balls with wave soldering can have different causes. The two most important are the solderresist and the flux. I have similar problems, after changes the flux type 90% off all solderballs are gone. KR, Joris Groot koerkamp
Electronics Forum | Fri Aug 24 12:39:59 EDT 2007 | hussman
I would say no, unless your machine is in extremeconditions. You may want to check your flux / preheat out as well. If you are leaving a lot of flux on the board at wave, it may be boiling - which can cause solder balls.
Electronics Forum | Mon Apr 25 11:24:31 EDT 2005 | Daan Terstegge
I have a question about inspection, touch-up, and how far you need to go to get a product that meets the required IPC-spec. According to some reports (i.e. "New Study Reveals Component Defect Levels" by Stig Oresjo of Agilent) the average defect leve
Electronics Forum | Wed Nov 03 09:42:31 EST 2004 | dramos1
Hi Simon, Thanks for the immediate reply. We really appreciate it very much. Currently, we are using Class 2 for the visual inspection criteria of our telecom boards. In IPC-A-610 Rev. C criteria, there are TARGET, ACCEPTABLE and REJECT criterias.
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Thu Feb 22 21:01:12 EST 2001 | davef
We don't do this, but if we had to and lacking better advice, for all components I�d dry pack according to J-STD-033, store in a low temperature and humidity controlled environment [maybe using some semicon fab inert storage cabinets], review the eff
