Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
Electronics Forum | Wed Apr 27 14:10:30 EDT 2005 | Bruno Lalonde
I m looking to implement a maintenance program here at Exfo, I'm looking form the norms on the hand soldering iron (tip to ground resistance and Voltage linking). Thank
Electronics Forum | Wed Apr 27 21:59:34 EDT 2005 | davef
Check with your soldering iron supplier. We'd expect them to say: * Tip to Ground Resistance:
Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Mon Feb 26 08:58:01 EST 2018 | altus_group
Hi Wnb_Pemgr, I am not sure where your facility is based but I was hoping that we might be able to help with some of your issues? Hopefully we can support you with any ongoing problems you have or escalate any cases you have already made with Koh Yo
Electronics Forum | Tue Apr 08 16:03:29 EDT 2003 | jonfox
MTBF is hard to nail down raw data based on whether or not it is classified as IPC CII or CIII alone. Given that most failures are environmentally based, you might be able to get this data for CII and CIII in similar environmental testing situations
Electronics Forum | Thu May 06 10:52:08 EDT 2004 | John S
Many component manufacturers are moving to Pb free terminations. I've been doing a literature study of Pb free processing and have found several articles that indicate Pb-free paste with Sn/Pb terminations leads to early fatigue failures. Does anyo
Electronics Forum | Tue Aug 31 17:36:36 EDT 2004 | davef
NO-LEAD COMPONENTS WITH LEAD SOLDER ISSUE: We agree with Russ. We've dicussed this several times on SMTnet. For instance, look here http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=25394 LEAD COMPONENTS WITH NO-LEAD SOLDER ISSUE: We disa
Electronics Forum | Tue Sep 22 16:39:10 EDT 2009 | rmitchell
Hi, We are getting a E-Hydra-1 Frame grabbing failed on caps and resistors and also a Light Curtain trigger X wagon. I spoke with mydata and they indicated the light curtain might be getting set off and causing the frame grabbing failure. I cleane
