Electronics Forum: j-std-001 and pdf (Page 3 of 9)

floor and air conditioning, shop floor requirements

Electronics Forum | Thu May 02 15:29:19 EDT 2013 | jim_n_hky

I can't answer your specific question on the floor, but I have some suggestions. The equipment manufacturer should be able to provide the floor loading requirements. A structural engineer should be able to translate that into specs for hte constructi

J-STD-001 Par 4.2.2 Temperature and Humidity

Electronics Forum | Tue Jul 17 21:48:09 EDT 2007 | davef

Per ESD Handbook TR 20.20 paragraph 5.3.15 Humidity "Humidity is beneficial in all ESD Control Program Plans. Contact and separation of dry materials generates greater electrostatic charges than moist materials because moisture provides conductivity

Pick and Place tutorials

Electronics Forum | Wed Oct 01 15:34:22 EDT 2003 | johnpatricelli

It won't help your operation of a pick and place machine, but if you are just beginning to train your Operators, an excellent beginners' reference for SMT parts and package recognition can be found at TopLine Dummy Components' website, http://www.top

Rohs and WEEE

Electronics Forum | Sat Jan 01 09:57:55 EST 2005 | davef

Rohs and WEEE are good intentioned, wrong-headed Eurolander legislation that impacts the electronic industry worldwide. Look here: * http://www.dti.gov.uk/sustainability/pdfs/finalrohs.pdf * http://www.dti.gov.uk/sustainability/pdfs/finalweee.pdf *

UPS and ROHS Compliance

Electronics Forum | Fri Jan 27 09:48:26 EST 2006 | patrickbruneel

GS UPS are exempt for 2 reasons: A. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications. B. The primary functi

How does temperature and humidity effect solder paste/printing

Electronics Forum | Wed Apr 11 22:05:58 EDT 2001 | davef

OA pastes are more hydroscopic than NC pastes. Hydroscopic. The capacity of a material to absorb and retain moisture from the ambient air. Sometimes this is compounded if you remove paste from the frig and let it warm to room temperature, because

Need help on PCBA Cleanliness Standards and Specs

Electronics Forum | Tue Nov 25 22:25:24 EST 2003 | davef

We had a similar problem on the high impedance front end of a MOSFET amplifier a few years ago. If your situation is like ours, the issue is not what a consensus specification [like J-STD-001] defines as an upper limit, but what your product is defi

"Gap" in completed solder joint between lead and pad

Electronics Forum | Thu Nov 30 16:10:05 EST 2006 | Hussman

Wow, why all the anger? This gap you guys are talking about is measured as "G" in IPC/EIA J-STD-001 (Chunks was there, but she failed to read the fine print). And almost all parts that measure G follow Note 3 which states "Properly wetted fillet s

Possible to mix a No-Clean solder and a Clean solder process

Electronics Forum | Fri Apr 06 12:31:07 EDT 2018 | deanm

Your fluxes are required to be compatible per J-STD-001. I wouldn't even attempt mixing no-clean (rosin) and clean (assuming water soluble) fluxes on the same assembly, especially if the fluxes are from two different vendors. If your paste and liquid

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i


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