Electronics Forum: j-std-033 (Page 3 of 17)

MSD Packaging Standard

Electronics Forum | Sat Nov 18 08:56:47 EST 2006 | jdumont

Nothing is missing I suppose. I was looking to see if there was another standard more appropriate to add to our POs. Something like, "all incoming material must be packaged according to J-Std-033B under penalty of death...or returned material."

problem in solderability

Electronics Forum | Fri Aug 29 07:56:56 EDT 2008 | davef

Omid It depends. Follow the guidelines of ANSI/J-STD-033, Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices. It's available on-line.

J-STD-033B.1

Electronics Forum | Wed Feb 17 06:34:46 EST 2010 | nico67640

8H the only possible reaction is to bake this component?This is correctly? Many thanks for your help Nicolas

J-STD-033B.1

Electronics Forum | Thu Feb 18 06:32:29 EST 2010 | nico67640

If I place a MSD level 4 open more than 8 hours in a dry cabinet

BGA baking

Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman

If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory

Problems Using Parts From Broker

Electronics Forum | Mon Sep 09 15:38:20 EDT 2013 | action_101

For the proper baking durations for msd componrnts you should follow the ipc/jedec j-std-033b standard. Just google that standard and the pdf should come up. On page 16 there is a complete table showing the temps and durations.

MSD Control in low humidity environment

Electronics Forum | Wed Aug 05 18:36:19 EDT 2015 | caurbach

John, I assume you mean 60%, not 65%. J-STD-033 has a derating table for floor life which accounts for conditions other than 30C/60% RH. Table 7-1 is what you're looking for I believe. Adam

Baking BGA on reel

Electronics Forum | Mon Jul 04 09:08:41 EDT 2016 | davef

IPC/JEDEC J-STD-033B.1 Includes Amendment 1 Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices [http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf]

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Fri Feb 02 05:11:29 EST 2018 | deanm

I developed our company's procedure for moisture sensitive devices based on J-STD-033 and I don't recall anything requiring a certain ramp rate. Furthermore baking at 85C will greatly extend the time to reset the clock and it is harder to maintain

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Fri Feb 09 09:42:33 EST 2018 | jmedernach

I completely agree. J-STD-033 spells out the "how to" of baking, quite clearly. You have to bake something for an expensively long time at 80 - 85C in order to properly desiccate your components.


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