Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
Electronics Forum | Mon Oct 12 10:26:52 EDT 2015 | eniac
My greetings to all. Time to time I receive the next results of modems soldering: http://i.piccy.info/i9/71ae4c358c6e4bc3f1cbf140495bc437/1444660170/135005/872954/GL868_7.jpg or http://i.piccy.info/i9/d1181be142e285a39b49b81d37bde72a/1444660270/1
