Industry News | 2012-06-12 12:44:37.0
ACD recently celebrated the 25-year anniversary of one of its Senior Designers — Hal McLarry. Hal has grown with the company from when it was only six years old with six employees to more than 175 employees today.
Industry News | 2012-06-12 12:44:50.0
ACD recently celebrated the 25-year anniversary of one of its Senior Designers — Hal McLarry. Hal has grown with the company from when it was only six years old with six employees to more than 175 employees today.
Industry News | 2014-09-06 19:28:28.0
Juki Automation Systems (JAS), Inc. is pleased to announce that Frank Ruiz has been promoted to Applications Engineering Manager – Western US, and Larry Moon has been promoted to Applications Engineering Manager – Eastern US.
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New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s - Dri
Industry News | 2013-03-27 16:39:31.0
Inovaxe, a world leader and provider of innovative material handling and inventory control systems, has appointed iTECH Inc. as its manufacturers’ representative throughout the Carolinas and Virginia.
Technical Library | 2008-08-20 17:28:19.0
Kitting is the first step in printed circuit board assembly. It is initiated well in advance of the actual production start to be able to prepare and deliver the kit on time. Kitting involves the gathering of all the parts needed for a particular assembly from the stockroom and issuing the kit to the manufacturing line at the right time and in the right quantity. This paper discusses kitting, describes ways to eliminate waste in different phases of kitting, and illustrates lean kitting using a case study conducted in a major contract manufacturer site.
Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Technical Library | 2021-07-06 21:24:59.0
The amount of information transferred on wireless networks has increased dramatically with the tremendous growth of mobile phones, Internet access, and hand held devices. In order to build the infrastructure needed to handle ever increasing data transfer, manufacturers of electronic devices turn to high speed, high frequency electronic signals. The need to render these electronic devices portable is another technology driver. The merge of high-frequency signals with small geometry conductive traces means that the topic of signal loss has reached a critical point in existing device production.
Industry News | 2012-01-23 14:11:28.0
Speedprint Technology announces the appointment of iTECH Inc. as its manufacturers’ representative throughout the Carolinas and Virginia.
Industry News | 2017-07-10 21:20:40.0
KIC announces the appointment of Larry Fey as Principal Electrical Engineer. Fey is an exceptionally skilled and accomplished electrical engineer with more than 27 years of hands-on design experience. He has been active in all phases of product development, including feasibility studies, planning, design, CAD, assembly, testing, field trials, production support and customer assistance.
