Electronics Forum | Wed May 14 18:22:07 EDT 2014 | hegemon
Dave is touching on one of those magical things that keeps us process engineers well paid and dancing (Well, some of us, lol). Heavy boards with light components. Solder Follows heat. Component heat up earlier. Repeat, Solder follows the heat. Care
Electronics Forum | Mon May 12 13:55:19 EDT 2014 | hegemon
It sounds like a bit too much solder on the PWB, caused by too large a pad for the lead it will contain. In that case solder reduction is the way to move forward. What are the options there? 1. New stencil or stencils - (not desirable) 2. Increas
Electronics Forum | Tue Jun 03 18:34:22 EDT 2003 | Kris
Hi, There have been other studies where it was found that lead-free soloder joints are more reliable than tin-lead solder joints irrespective of test conditions. In fact the automotive industry has been using Sn/Ag for underhood applications for a
Electronics Forum | Wed Jul 27 16:46:48 EDT 2005 | russ
I don't think that you would need to test these. Have you ever seen any evidence of solder sticking to them? We use the same material and never notice anything besides flux staying on the bottom. Would the lead absorption if any even be of a concer
Electronics Forum | Fri Jul 06 12:11:34 EDT 2007 | james
We are starting to see issues with using Kester WS R562 with lead free components. The joints look grainy on almost all of the 0402'2 and other small components. Some of the solder does not solder to the terminations. These are hybrid boards which
Electronics Forum | Tue Jun 03 12:24:50 EDT 2003 | blnorman
I have received information from the European Commissioners Environmental group that automotive electronics are not covered by WEEE (waste electrical and electronic equipment 2002/96/EC) or RoHS (reduction of hazardous substances 2002/95/EC) because
Electronics Forum | Fri Jul 06 12:39:01 EDT 2007 | blnorman
What's the metallization on the board? We use an immersion tin board and had to increase our profile to successfully solder.
Electronics Forum | Tue Dec 04 09:48:43 EST 2001 | davef
Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org. Factors that affect this are: * Amount and composition of solder * Amount and compo
Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman
Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili
Electronics Forum | Fri Jul 06 13:44:15 EDT 2007 | shrek
Krikies! seems like a head-scratcher if I may say so me-self. I would say the other ogre is right, that surface finish will play a big factor in your solder joint's grain structure or how shiney 'tis. Non-HASL bearing finishes will typicaly exhibit
.gif)
