Electronics Forum | Tue Dec 15 14:38:23 EST 2020 | emeto
I have done it different ways on different equipment. 1. Remove alloy one from the machine. Add alloy two only. and use it.For next board, do the same. 2. There are machines with separate sections for PB and PC-Free, so pots are away from each other
Electronics Forum | Thu Dec 10 12:12:40 EST 2020 | robl
Yep, done it previously with a multipot machine. Using with wirefeed to top up the pots means you only have a contamintion risk when you fit a new top up reel. Used separate nozzles for both, but theoretically using titanium nozzles would mean no c
Electronics Forum | Thu Nov 15 03:07:35 EST 2012 | nikyta
Thanks for your reply. As already said by Anvil1021, is not a good idea to mix Lead and Bismuth! Stay away from Bismuth if you have even the slightest traces of Lead on yours PCB, stencil, squeegee, spatula, blade, cleaning paper or cleaning cloths,
Electronics Forum | Fri Nov 02 03:26:40 EDT 2012 | spopov
Hello! We want to try Lead Free paste Sn42/Bi58. Can we use this paste with Lead fihish such as HASL. I am worry about low melting temperature of 138C.
Electronics Forum | Tue Nov 06 22:37:35 EST 2012 | davef
Ryan ... "As for bismuth-based lead-free alloys, a lower melting temperature than that of tin-lead is offered together with a cost similar to that of tin [in the area of $3/lb]. Unfortunately, bismuth in soldering alloys tends to create embrittlemen
Electronics Forum | Fri Nov 02 09:09:56 EDT 2012 | davef
Sure you can use it it with leaded HASL. Recognize that ... * Your Sn42/Bi58 will no linger be Sn42/Bi58 * Your leaded HASL will no longer be the same leaded HASL that walked in the door to your plant * Lead from HASL coatings can diffuse through the
Electronics Forum | Fri Nov 02 14:46:18 EDT 2012 | ericrr
So how does this (lead free paste Sn42/Bi58) solder compare with the Sn-Ag-Cu (Tin-Silver-Copper) combination which does not flow as well (in the oven), needs higher oven temperature, (that can be adjusted by reducing the oven chain speed) and cost m
Electronics Forum | Wed Nov 07 15:01:18 EST 2012 | nikyta
Thanks Dave , my question is about Spopov want to try "Lead Free" SnBi (but uses it on Leaded finishes), but is worry about its low melting point (at this point, no longer 138 degrees as he wrote, but rather in an unknown and unpredictable range bet
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken
profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r
