Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Sat Jun 30 11:03:29 EDT 2001 | davef
Nice to have you back on SMTnet. Some of the newer folk have missed-out on the solid contributions you�ve made to the Forum. The chicken wire cleaning basket was a classic!!! [It�s a shame that the folk at SMTnet can�t recover those files.] We bu
Electronics Forum | Fri Jun 24 17:08:13 EDT 2005 | franciscoioc
Hi Everyone, I need everybodys help on this one. We are a company that suppose to be exempt from the Lead-Free world and we were happy untill we find out alot of the Components manufacturers will change their parts to Lead-Free but not their part nu
Electronics Forum | Thu May 01 15:11:37 EDT 2008 | dphilbrick
CK So as I see it batch B represents a leaded process with leaded components and D is a leaded process with lead free components. Batch Components Paste B SnPb Sn62 D Lead-free Sn62 If so it is BETTER to run a lead free BGA with Sn
Electronics Forum | Tue Jul 19 08:51:29 EDT 2005 | GS
any thanks Rob, te specimen label Anglia is some thing complete and very helpful example. Hope Comp Suppliers will take care about the needs of Users (mainly if they are small EMS). To know how the terminals/leads are metal finisched is important f
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Mon Jul 18 13:34:31 EDT 2005 | jzaccari
Francisco, You need to be concerned about "lead-free" BGAs. The SAC balls will not reflow at at standard tin-lead process temps. I have seen many examples where this has been a very big problem. In once case the BGAs just poped-off when the board was
Electronics Forum | Mon Jan 10 18:16:32 EST 2005 | ricardof
Greetings from Mexico I can see several good opinions about the "real" need to chnage to Lead-Free processes, but at the end and trying to be real, is there any good path we could follow to stop this process? I can see a lot of work, investment in eq
Electronics Forum | Tue Jan 31 12:13:26 EST 2006 | Calvin Kolokoy
Today's regular Sn-Pb paste chemistries are designed to run at higher peak temperatures ensuring that your lead-free alloys will coalesce with your regular Sn-Pb solder. That being said, it is do-able to solder both types in one oven. Generally, wit
Electronics Forum | Wed Aug 18 21:10:23 EDT 1999 | se
| | | Hi, | | | I'd like to ask some tips about the merits and shortcomings o | | | of both screen printer and stencil printer. For small quantity and highly mixed usage, which type of printer is suitable to our | | | application? | | | The board
