Electronics Forum | Tue Dec 21 12:11:06 EST 2021 | jseewald
You likely have raised belly pads. If possible, do a step-up on the thermal pads to compensate for the additional height of the component in this area. Some reduction/adjustment of the gullwing pads may be necessary, so be prepared for a few iterat
Electronics Forum | Thu Nov 11 10:55:32 EST 1999 | KenF
Hi, could anyone tell me the maximum size of an SMD ceramic capacitor that can be assembled on a copper based substrate reliably? The SMD will be reflowed on the copper substrate. The main concern is the CTE mismatch between the ceramic capacitor and
Electronics Forum | Thu May 26 21:07:22 EDT 2005 | KEN
This is caused by cte mis-match. The balls in the corners are short and fat. The balls near the null point are tall and more normalized. I don't remember what the zone settings were... BTU VIP98 BS was probably 22-25 IPM
Electronics Forum | Tue Jul 25 11:30:47 EDT 2006 | DC
Russ, we had similiar issue on the corner seperation. The board is ENIG and the part is Altera FBGA 1020 (Super BGA) and reflowed by tin/lead paste. Please comment your concern on Altera parts! Is CTE mismatch?
Electronics Forum | Thu Jun 15 07:20:23 EDT 2006 | William G.
How are your experiences with stencilling 0201 components on large circuit boards, i.e. 400 * 250 mm ? Will there not be too much mismatch between between stencil and (FR4) boards? If so, would dispensing be a solution? Any other solutions?
Electronics Forum | Thu Jun 15 07:39:04 EDT 2006 | Chunks
Dependig on your process. If you use the same Gerber data that made the board to make your stencil, by a reutable stencil manufacturer, then no you should not have any mismatch issues.
Electronics Forum | Thu Apr 16 08:01:38 EDT 2009 | kpm135
I've had some luck with longer soak. Of course that was on a board with severe thermal mismatches so I don't know if it will help your problem or not.
Electronics Forum | Tue Aug 24 10:07:22 EDT 2010 | davef
Solder mask misalignment: mismatch in registration between the solder mask and the features on the PCB. It when the things that are supposed to covered are not covered by the solder mask.
Electronics Forum | Mon Sep 08 09:11:30 EDT 2014 | jdenuzzia
We resolved this issue a few weeks ago. It was a configuration mismatch in the oven (MR933+)software with the onboard O2 analyzer.
Electronics Forum | Fri Jan 19 13:52:01 EST 2018 | heatherc
FactoryLogix from Aegis has this ability. It will also then compare the BOM to CAD in seconds. Some examples of the checks it will do - references missing on either (confirms non-pops), qty on BOM that mis-matches the number of references listed, e
