Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2018-08-21 14:28:35.0
Clariant's new Humitector Type 2 Non-Reversible Humidity Indicator Cards contain a patent-pending non-reversible 60% humidity spot indicator which enables them to indicate whether dry packed surface mount devices (SMDs) have been exposed to high levels of moisture at any point during shipment or storage. This unique innovation offers a major step forward in preventing moisture-compromised surface mounts from entering production.
Industry News | 2018-06-13 12:52:51.0
Market's first non-reversible humidity indicator Card Type 2 is low-halogen and cobalt-dichloride-free. Complies with the latest revision of IPC/JEDEC standard, J-STD-033D.
Industry News | 2024-01-16 03:45:38.0
Discover efficiency with I.C.T's Intelligent SMD Storage. Streamline processes, optimize space, and elevate SMT production globally. Explore now!
Industry News | 2016-12-02 15:47:10.0
BGA Rework Process Implementation
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Industry News | 2023-08-01 03:54:42.0
The aerospace industry has been a driving force behind technological innovation, with its advanced technologies finding increasing applications in other fields. This article explores how aerospace technology is employed in Surface Mount Technology (SMT) and Through-Hole Technology (THT) devices, ushering in new development opportunities for the electronics manufacturing sector.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2016-06-27 14:54:49.0
In September of 2015, IPC delivered revision D of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards. Building on this base standard, IPC has developed the first automotive addendum, IPC-6012DA, Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2023-08-01 06:13:48.0
Industrial control applications play a vital role in modern manufacturing processes, ensuring precision, efficiency, and reliability in diverse industries. Two significant electronic assembly technologies, Surface Mount Technology (SMT) and Through-Hole Technology (THT), have long been used independently in the manufacturing sector. However, with the continuous evolution of technology, the integration of SMT and THT industries has emerged as a powerful trend, driving innovation, and offering new possibilities for industrial control applications. In this article, we will explore the synergies between SMT and THT, showcasing how their combination enhances industrial control solutions, making manufacturing processes smarter, faster, and more versatile.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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