Electronics Forum | Thu Aug 16 20:11:21 EDT 2001 | davef
Hussman is correct. Make those people quit. [Just walk-up, pimp slap 'em, grab their dental pick, and say "Dave says you can't use this any more. I'm just following orders."][Trust me, this is much smoother than the "Tonya Harding Approach" that I
Electronics Forum | Tue Nov 22 21:08:45 EST 2005 | davef
CMI International says, there are five basic, non-destructive methods of determining coating thickness. Each method was devised to achieve cost-effective, accurate, and repeatable results. Those methods are: * X-Ray fluorescence * Eddy-current * M
Electronics Forum | Wed Jan 07 00:18:14 EST 2009 | milanrit
Recently on one of my assemblies(sn/pb) I started seeing leaded BGA failure at functinal test for opens, but when I inspected them through 5DX and ERSA Scope it doesnt seem like there is any opens or insufficient and half no. of boards passed functio
Electronics Forum | Mon Jan 15 14:25:54 EST 2001 | davef
Let me make several points on this issue � POINT 1: Let�s be basic � Soldering and welding are examples of process that the quality types call "special processes". Special process. The results of special processes cannot be verified fully by subs
Electronics Forum | Thu Oct 15 11:04:53 EDT 1998 | Justin Medernach
| | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | Q: Can you get away with spending 25K?
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Thu Oct 15 14:33:37 EDT 1998 | Earl Moon
| | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | Q: Can you get away with spending
Electronics Forum | Thu Oct 15 17:20:25 EDT 1998 | Justin Medernach
| | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | Q: Can you get away with sp
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Fri Oct 16 07:33:01 EDT 1998 | smd
| | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | Q: Can you get away w
