Electronics Forum | Fri Oct 08 02:31:07 EDT 1999 | Brian
| | | | Hi, | | | | | | | | Help! Could anyone help to enlighten me on this? | | | | | | | | Question: | | | | | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowab
Electronics Forum | Wed Oct 06 11:40:41 EDT 1999 | Debbie Alavezos
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Fri Sep 01 16:44:41 EDT 2017 | dgaddisatprimepower
I've been struggling trying to get our TP9 machine to place 8-dfn package parts. One of our primary assembly contracts uses a SOIC8 but the pad design accommodates an alternate 8-DFN part and sometimes we have to go to our alternate part due to lead
Electronics Forum | Wed Sep 29 09:35:39 EDT 2010 | blnorman
Can any body help me that how can I check the > strength of the 0603 capacitor & how much it > should be? Is there any standard for the > soldering strength of the Diffrent SMT > packages. Manjeet singh I'm not aware of a standard that provides
Electronics Forum | Tue Jun 01 12:57:52 EDT 1999 | John Sims
I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test metho
Electronics Forum | Mon Dec 04 03:40:43 EST 2000 | jmlasserre
Hello, When we discover the broken caps, there are missing and we can observe only either the 2 terminaisons or a small part of ceramic. The defect is due to a shock during the process but it's possible that the caps are fragilized during an operati
Electronics Forum | Wed Jun 02 06:53:44 EDT 1999 | Earl Moon
| I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test met
Electronics Forum | Mon Jun 07 11:21:38 EDT 1999 | Brian Wycoff
| | I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test m
