Electronics Forum: pad and design (Page 3 of 171)

smt common pad 0402 and 1206 package

Electronics Forum | Mon May 09 09:23:45 EDT 2016 | markhoch

I agree with the previous two replies. This is a perfect design....if you're trying to create a graveyard full of tombstones.

Thermal Relief BGA pad design traces

Electronics Forum | Mon Jun 02 16:33:35 EDT 2008 | operator

Is there some good resources (.pdfs, websites, articles) that someone can point me to regarding design for bga footprints? I need to brush up on thermal relief design for bga footprints. I got a customer whose bga lands are masking defined on top of

CCGA - Stencil design and Reflow Profiling

Electronics Forum | Fri Aug 23 12:33:37 EDT 2019 | ameenullakhan

Hi , Its CCGA part . with normal PCB pad opening similar to other BGA pad . Yes its very surprising and we are not able to analyze. What exactly went wrong. We have new stencil design for this now. Will run it tomorrow. Will update the results.

SMT solder pad design for hand soldering

Electronics Forum | Sat Apr 19 12:00:07 EDT 2003 | modeltech

I am completely new to SMT design and for my next project I plan to use SMT for the first time. Since production volumes of the PCB's will be low, hand soldering is definitely an option, and will be necessary for my prototype PCB assembly. My proble

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

black and grey pad

Electronics Forum | Sat Oct 06 08:42:21 EDT 2001 | davef

Please give us additional background on your board, solder, process, etc. If you are talking about black pad in ENIG solderability preservative, check the fine SMTnet archives to get started.

VSSOP 0.4 mm Pitch pad design & Stencil aperture

Electronics Forum | Mon Dec 18 21:17:41 EST 2006 | davef

Use the IPC calculator [free at http://www.ipc.org]

Re: Standard pad sizes for reflow and wave

Electronics Forum | Tue Sep 07 09:11:33 EDT 1999 | Dave F

| We've noticed that there are many different recommendations for pad sizes for various SMT parts. This seems to vary wildly from manufacturer to manufacturer for the same case sizes. Is there any standards that can used used to specify these sizes

pad cratering

Electronics Forum | Wed Jul 01 13:17:39 EDT 2015 | davef

Cheryl Tulkoff and Randy Schueller do a good job summarizing the thinks on pad cratering here: http://www.smta.org/chapters/files/uppermidwest_padcratering.pdf Potential Mitigations to Pad Cratering * Board Redesign * Solder mask defined vs. non-s

VSSOP 0.4 mm Pitch pad design & Stencil aperture

Electronics Forum | Thu Dec 14 22:28:38 EST 2006 | Tony

Hi, where can I find info about how to make the pad design to work for VSSOP48 0.4 mm Pitch & TSSOP56 0.5 mm pitch components? I should also mention that we are working in a project that this 14 layers High-Frequency RoHS board is included. The pad c


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