Electronics Forum | Wed Jan 20 07:31:58 EST 2021 | denism
Hi, Option 3 is quite often used, while it is better to glue with uv glue using uv lamps for curing. For this process, two inverters are needed in the line, a dispenser for UV glue and a UV lamp (eg metronelec UV CURE OVEN). It is better to use prefo
Electronics Forum | Tue Sep 29 21:39:07 EDT 2020 | kylehunter
Hi, We are currently working on a board that has 3x 50-pin THT at 1.27mm pitch each. This is too small for us to be able to consistently do on our selective solder. We are instead considering pin in paste. The connector we are using can be spec'd at
Electronics Forum | Mon Aug 25 20:49:27 EDT 2003 | msimkin
Anyone use glass filled nylon connectors utilising the intrusive reflow techique (pin in paste). We are having probe with them becoming brittle after reflow- apparently due to moisture. We are also seeing bubbling on outside plastic.Peak oven temp 22
Electronics Forum | Thu Dec 03 21:40:01 EST 2020 | itmconsulting
Hey Kyle - Good for you for pushing your horizons and considering pin-in-paste (aka "Intrusive Soldering"). Don't let the nay-sayers out there discourage you. When I encounter mixed tech PCBAs (SMT and through-hole) my first choice, if the design a
Electronics Forum | Tue Dec 15 09:26:37 EST 2020 | stivais
Have you tried cutting the leads shorter (or lift the connector slightly) so that they barely protrude at the other side of the PCB? Just for testing purpose, for mass production you should find a connector with shorter leads then. This should help w
Electronics Forum | Thu Jun 24 09:57:44 EDT 1999 | Vic Lau
Dear guys, I have some problem on assembling micro-BGA with solder paste (63/37). The micro-BGA we assmeble is 0.75mm pitch and with 45 pin (solder bump is 96.5/3.5Ag). The stencil is a laser-cut stencil with 5 mil thickness. We are now using a no
Electronics Forum | Thu Sep 04 10:24:39 EDT 2003 | paulrm
The typical PIP process is incorporated into the surface mount process. This approach requires the following: The stencil will be designed so that the correct amount of solder paste can be printed onto the through-holes to form an acceptable joint
Electronics Forum | Thu Dec 17 15:53:32 EST 2020 | dwl
for option 3, if you place the connectors on the first pass then flip the board, won't the protruding leads interfere with second pass stencil printing? My vote would be to overprint onto the solder mask. you can print pretty far and still have it w
Electronics Forum | Tue Aug 26 22:56:39 EDT 2008 | omid_juve
we have solderability problem(some pins aren`t soldered) with two devices in our board with the below detail EP1K30QI208-2 brand:ALTERA with the package PQFP-208 TMS320VC5416PGE160 brand:TI with the package TQFP144 these two devices are pb free but t
Electronics Forum | Mon Aug 18 11:20:08 EDT 2008 | pjc
Stencil apertures are cut to deposit solderpaste onto the annular ring, provided its wide enough. Then you can place a solder preform if needed to ensure there is enough solder to fill the barrel. Here is some information on solder preforms: http://
