Electronics Forum | Thu Feb 23 09:59:09 EST 2006 | SIR
We have an AUREL CS1222 machine to measure the thickness of the solder paste deposited on a bare board by a stencil printer. This device has a laser beam that has to be put on the pad where you want to measure the solder paste thickness. The measure
Electronics Forum | Sun Sep 08 22:38:23 EDT 2019 | sssamw
what's your final verified ok stencil thickness for the QFN and BGA?
Electronics Forum | Tue May 21 15:00:28 EDT 2019 | emeto
Hello Greg, Here are a few questions and advises that might post an answer: 1. How thick is your current stencil and what is the part that requires that thickness? 2. Can you use a carrier to keep your board straight and avoid board warpage? May
Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw
6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.
Electronics Forum | Tue Jun 07 10:38:34 EDT 2011 | davef
Boots: Here's several methods for guessing at the amount of solder on your connection: * First, 'Down & Dirty' ** Assume that the solder is flat, which is reasonable since it's 'flattened' by the component package ** Assume 100% paste transfer from t
Electronics Forum | Mon May 20 12:01:37 EDT 2019 | gregoireg
I have a PCBA job which has on the top side a few standard QFN components (0.4mm pitch) and a big module (35mmx60mm) with 1.13mm BGA pads: https://imgur.com/a/YUGgejW To be clear, this module is composed of a PCB with some components on top and some
Electronics Forum | Tue May 21 15:36:22 EDT 2019 | gregoireg
Thanks to @davef and @Evtimov for trying to help. It's useful but not exactly the answers I would like to get. I'm going to reformulate my question. I'm writing in mm so that it's more precise: I have a 0.12mm-thick stencil for some 0.4mm-pitch QFN
Electronics Forum | Thu Feb 08 14:55:30 EST 2007 | pavel_murtishev
Good evening, I do. 2mil overprint is not critical. Paste will simply flow back. Paste flows back even with larger overprint (up to 15mil at least). 5mil stencil thickness if fine also. BGA area ratio for both BGAs is higher than 0.66 required by IP
Electronics Forum | Fri Apr 11 06:22:04 EDT 2008 | andrzej
Hi Andrzej, > > We are using for BGA (0.8 pitch) > square apertures size 0.4 mm (rounded corners r = > t) and stencil thickness t=5 mils. So area > ration-_ w/4t=0.8 > > Regards Jan Hello Jan, I understand that you have the same pad dimensio
Electronics Forum | Wed Feb 22 10:00:58 EST 2006 | dougs
We've just set up a couple of products with 0.5mm pitch uBGA devices on them, i went for 5thou thick, laser cut nickel (to aid paste release) square pads same size as the diameter of the uBGA pads. Or you could go to a 4 thou nickel stencil, better
