Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Wed Mar 12 08:03:30 EST 2003 | Surachai
Hi all Pls. help advise. Our board use RMA solder paste (Pb-free Sn96.5/Ag3.0/Cu0.5). Can we use No-clean paste flux (Delta 670S1) in rework process? If it can not be used, why?. Thanks very much for your advice. Surachai
Electronics Forum | Tue Nov 29 12:16:29 EST 2005 | Inds
MKS, You do not need to reach a temp of 245C to form a joint and surely not for 0603s. Since you are using such a high temp your flux is getting dried out.. Also if you are going to reach a peak of 245C on a brd that has Sn/Pb compt and Pb-free.. yo
Electronics Forum | Fri Dec 08 21:23:16 EST 2006 | Harsha
I am seeing a problem of flux droping on the PCBA during reflow. This is a pb free process and I am using KOKI pb free paste with 8 zone (and some 9 zone) reflow ovens. Line throughput is about 10,000 boards/24 hours. I suspect that the exhaust is no
Electronics Forum | Wed Apr 04 08:45:37 EDT 2007 | meritajs
Hi, colleagues! We only start using pb-free tehnology Our wave have foam fluxer What kind of flux would be best if we will use Sn100 solderbar What is your experience Best regards Peter
Electronics Forum | Wed Apr 04 10:48:25 EDT 2007 | pjc
Indium Corp. has some, 3549-HF and 3590-T, both are OK for foaming. Most of the better performing newer fluxes require spray application for best performance. Alpha, Kester and others have wave fluxes too. http://www.indium.com/products/circuitboar
Electronics Forum | Tue Dec 15 14:38:23 EST 2020 | emeto
I have done it different ways on different equipment. 1. Remove alloy one from the machine. Add alloy two only. and use it.For next board, do the same. 2. There are machines with separate sections for PB and PC-Free, so pots are away from each other
Electronics Forum | Fri Aug 26 09:57:21 EDT 2005 | russ
The Immersion gold is not a problem with BGAs specifically but "black pad" which can be present anywhere. The unfortunate thing with BGAs is you cannot see it. Personally I hate white tin. It is okay for single sided boards running no-clean, but c
Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics
This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of
Electronics Forum | Tue Aug 22 10:47:28 EDT 2000 | Dr. Ning-Cheng Lee
The European WEEE has issued a new (5th) version of its recommendations. In it they say that , on January 1st, 2004, they will review the status of the Pb-Free issue. There is currently NO DEADLINE for implementation. As far as a direct replacemen
