Electronics Forum | Tue Dec 07 10:57:29 EST 2010 | davef
Warpage tells you that design and/or fabrication process and/or assembly process need[s] to be corrected. Here's a link to a recent thread on SMTnet that seems to answer some of your questions: http://www.smtnet.com/Forums/Index.cfm?CFApp=1&Message_I
Electronics Forum | Sat Dec 18 08:23:33 EST 2010 | remullis
I experienced warpage on a 7'x 13" long board, unfortunately my oven does not have center support. I use stiffeners on both of the short ends. It fixed my problem. Some of the things I was experiencing with the warpage on the second pass were placem
Electronics Forum | Thu Aug 09 01:05:03 EDT 2012 | sajith09
I would like to understand What will be the allowable warpage for 152mm length PCB. We are observing about 1.5mm warpage. Is that acceptable? Could you please share method to calculate the warpage
Electronics Forum | Fri Dec 17 10:42:58 EST 2010 | hegemon
I believe there is a lot pertinent information in the thread that Dave forwarded... But (IMHO)I think you can look at two things first. First, is your wave solder process friendly to this large PCB, is there enough pre-heat in the board before it h
Electronics Forum | Thu Aug 09 07:53:16 EDT 2012 | davef
Allowable bow & twist: Together, both IPC-A-600G and IPC-6012B represent the core IPC documents for describing the acceptable and nonconforming conditions that are either externally or internally visible on finished printed boards. IPC-A-600G relies
Electronics Forum | Sun Aug 25 20:18:32 EDT 2013 | RHL
Contact Akrometrix.com
Electronics Forum | Tue Jun 11 13:44:22 EDT 2013 | 7pcbassembly
Can you provide sample images to understand it in detail? It will give better idea about your explanation. http://www.7pcb.com
Electronics Forum | Fri Aug 30 11:20:17 EDT 2013 | jth
Hi, contact me at joe@zntechnologies.com. ZN Technologies offers warpage measurement at room temp and during reflow using the superior projection moire technique. Best regards, Joe
Electronics Forum | Tue May 21 15:37:36 EDT 2013 | armelinda
I am looking for a service providing non contact PCB flatness measurement for open board SiP assembly. It was returned for failure analysis with complaint that assembly does not solder properly onto customer system board. Since there are remnants o
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
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