Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka
Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou
Electronics Forum | Sat Oct 06 08:27:24 EDT 2001 | davef
Yes, some solder masks do not tent well, because the material is too thin. That�s the trade-off. Thin masks: * Conform well to [don't bleed onto] fine pitch features. * Tent vias poorly, requiring an additional "plugging" step. As you imply, if th
Electronics Forum | Mon Apr 12 10:39:48 EDT 2004 | Ron Herbert
Correct preheating of the assembly is critical. Check with your flux manufacturer regarding the recommended topside pcb temperature as it enters the first wave. It is important that this temperature be achieved without burning the flux on the bottom
Electronics Forum | Wed Sep 26 11:17:38 EDT 2012 | garym4569
We have been having a solder paste reflow issue which results in the solder not wetting to the LED lead. The solder appears to create "puddles" on the pcb pad. I have attached AOI image for review. We have had the pads analyzed for contamination, w
Electronics Forum | Wed Sep 22 10:03:07 EDT 1999 | Boca
| | | | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the s
Electronics Forum | Thu Sep 26 15:28:16 EDT 2013 | joeherz
I know - A stimulating topic.... IPC-TM-650 2.3.28 method calls for a PCBA or PCB to be placed into a bag with solution, shake, analyze. Great. There is a method of doing this testing that focuses on a specific area of a PCB or a component where r
Electronics Forum | Wed Mar 27 19:26:53 EST 2002 | ianchan
After a whole night's self review, I think we can term the slant/tilt as "floating 0805, yet end-terminals have acceptable solder joint formation". the width portion of the 0805 RES/CAP is (floating)elevated from the PCB pad, yet both (width) termin
Electronics Forum | Sat Aug 19 14:12:13 EDT 2006 | Wave Master Larry
LISTEN I'll have to disagree Steve.i think this Chunks person oversimplifies stuff and I dont like her style I'm surprised because most orientals do better with analyzing stuff.reminds me of some engineers at my place of employment.Again Im fighting
Electronics Forum | Wed Jul 24 09:50:20 EDT 2019 | amitthepcbguy
To perform conformal coating of PCBs in high power electronics applications follow IPC-A-600F and IPC-CC-830B conformal coating standards. This standard enlists several performance criteria. Additionally, this standard is considered as a good referen
Electronics Forum | Wed Sep 15 20:30:57 EDT 1999 | Bach Huss
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
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