Electronics Forum: pin in paste (Page 3 of 104)

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 15:10:48 EST 2006 | ms

Hi Steve Thanks for your reply. Your comments make it sound like it may be the nature of this paste. Any one else agree? Paste control is fairly good. Paste is put in fridge straight after it arrives at inwards goods, (4deg). Removed from fridge

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 10:26:59 EST 2006 | slthomas

It seems highly unlikely that you could actually trap enough air in your paste for it to be releasing air after you've worked it a few times unless it's not rolling properly to begin with. I suppose maybe a contaminant could be present that could b

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 19:32:28 EST 2006 | PWH

You mention "large ground plane pads in the center". Could it be that these large apertures are allowing the blades to "dig" which somehow pulls paste from adjacent apertures as the blades recover?

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 20:34:22 EST 2006 | ms

Thanks for the suggestion. The large ground pad appears as a single large pad on the component and PCB but we print a matrix of 28 small dots of paste to provide the solder for the joint. The inconsistent volume transfer can occur on any of the fo

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 22:20:04 EST 2006 | davef

Mike The air 'contained' in the aperture would prefer to escape between the board and the bottom of the stencil rather than through your paste while you're printing over it.

Air inclusion in solder paste

Electronics Forum | Mon Mar 27 10:28:22 EST 2006 | slthomas

Blasted back button. :/

Using solder paste in rework

Electronics Forum | Sun Apr 25 10:28:46 EDT 1999 | Joe Cameron

Hello all, Been doing some comparisons on joints made using the soldering iron versus reflowed solder paste (on a QFP package). The difference is quite significant: the joints made by the soldering iron are inconsistent and in many cases not filled

Re: solder paste in Flipchip

Electronics Forum | Tue Feb 17 01:15:26 EST 1998 | J.H Kim

In solder bumping in flipchip technology by solder printing, the precise control of solder volume and height is very difficult. Therefore I'd like to know the solution of this problem. Thanks

Re: solder paste in Flipchip

Electronics Forum | Tue Feb 24 01:19:01 EST 1998 | Jon Gruett

You are right !!! The exact volume of solder paste onto flip chips is extremely critical. Only one vendor that I know has taken that part of the process to the next level, whereby they can effectively deposit the right amount onto the flip chip exa

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes

We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a


pin in paste searches for Companies, Equipment, Machines, Suppliers & Information