Electronics Forum: pin oxidation (Page 3 of 6)

Pin hole

Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22

Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow

Bare Copper Pad Reflow Soldering

Electronics Forum | Thu Jul 29 23:21:51 EDT 1999 | CH Lee

I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. This ceramic substrate

Soldering PTH Card stiffeners

Electronics Forum | Tue Aug 13 12:22:03 EDT 2002 | dragonslayr

A bit of gray area for you. consider the application over the specmanship. Why are the stiffeners there in the first place? Is the rigidity requirement a high function i.e. very necessary due to potential shock and vibration , etc.? The soldering is

Copper oxide

Electronics Forum | Thu Jul 31 15:41:23 EDT 2003 | davef

Q: Could any of you guys tell me what exactly is this greenish thing ? A: No, but is not copper oxide. Copper oxide is brown, the color of a penny [here in the US] or an untreated copper laminated trace on a board. Many copper salts are greenish in

Copper oxide

Electronics Forum | Thu Jul 31 11:33:51 EDT 2003 | yngwie

I faced problem over connecter's pin that were hot air soldered. This connector has 168 pins ( similar to the straddle connector ). The process is to apply the flux onto the connector's J-leads, and the hot air pencil were then ran thru' the leads to

Re: reflow/cure/wave for double side assembly

Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam

| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run

solderability problem

Electronics Forum | Fri Nov 11 04:06:46 EST 2005 | arnold

we are manufacturer of molded type transformer. we have a trim and form process and its damage the pins of our units. the TIN insulation was being damage so we decide to immediately solder (wave soldering) the units to avoid oxidation. my question is

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Tue Feb 13 14:52:32 EST 2018 | emeto

I am totally with SweetOldBob on this one. Contamination or voids can also help to boost this defect, but considering that you are probably entirely burning off your flux in the soak zone, you might be getting oxidation on your pads and actually get

Re: Bare Copper Pad Reflow Soldering

Electronics Forum | Fri Jul 30 14:50:26 EDT 1999 | Kevin Hussey

| I received a request from customer to assemble ceramic substrate (alumina oxide)that printed with a low temperature Copper thick film conductor (the overglaze layer is polymer). The Copper pads are exposed without any coating. | This ceramic substr

Re: Altera PQFP240 Solderability

Electronics Forum | Tue Apr 14 09:38:07 EDT 1998 | Earl Moon

| We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X


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