Electronics Forum: pop (Page 3 of 36)

PoP parts

Electronics Forum | Wed Apr 16 14:55:05 EDT 2014 | emeto

Hege, The package is already built.

bubbles in solder pot

Electronics Forum | Tue Mar 14 14:34:02 EDT 2023 | joeljacobo

Hi, I think they are a bit of both. When they pop the bubbles something like a foam is generated.

Vapour phase soldering - problem

Electronics Forum | Tue Aug 25 10:38:03 EDT 2009 | grahamcooper22

Hi Sergey, Do you know the Moisture Sensitivity Level of the component ? This is normally recorded on the DRY PACK that the device comes in. It is not unusual for a device to POP CORN and still work in test. It depends how much damage there is to th

PoP parts

Electronics Forum | Fri Apr 11 12:42:29 EDT 2014 | emeto

Hello all, does any body place PoP parts? We are running them through a regular process(paste place reflow) and we don't have good rates on these. Mostly we observe opens at the sides of the part. We are thinking to purchase a flux feeder, but I wan

Solder masks for gold fingers

Electronics Forum | Thu Jun 04 09:29:21 EDT 1998 | Chrys

I have gold fingers that I want to mask when running over the wave without pallets. They're on the leading edge of the board. I recall seeing rubber boots that slid onto the fingers to mask them. Pop 'em on before the wave; pop' em off after and r

parts popping off during reflow

Electronics Forum | Thu Sep 13 11:21:45 EDT 2001 | aldo_maldonado

We've had several instances of parts (1206R, SOT-23) popping off of their location during reflow. Parts placement is OK, paste brick is aligned and compact before oven. But we get random parts off their location just lying somewhere else on the boar

BGA re-balling after "de-pop" spec question

Electronics Forum | Sun Jun 23 23:23:25 EDT 2002 | beldorian

First question - I am making an assumption that after "de-pop'ing" a BGA prior to socketing the thing to test it, the best known practice is to re-ball the thing. Is this an industry standard? Second question - If it is an industry standard, does a

Skewed and popped components

Electronics Forum | Tue Sep 23 23:19:34 EDT 2003 | RLW

If you have a board that you've run several times, now you run it and like before all settings are the same, but now you have 0603's randomly skewed or an inch or so away from their intended pad (as if popped up in the air), or an occasional 7343 cap

Solder Saver ??

Electronics Forum | Fri Apr 07 12:35:14 EDT 2006 | Chunks

Hi Chim Chim, Hows Spritle these days? You guys still living in the trunk of the Mach 5? Tell Trixie, Mom , Pops, Sparky, Racer X ans Speed I said "Hi". BTW, The Shooting Star (#9) was way faster than your brother Speeds. All be it that it took

Components jumping off the board

Electronics Forum | Sun Jul 13 10:33:08 EDT 2008 | mpolak

Hello, Recently I have change our profiles. After I profile one board it look really good, within the paste spec. But I have noticed when board leaves the reflow zone and enters the cooling zone it looks like popcorn effect some components jumping o


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