Industry News | 2020-06-18 14:14:42.0
MIRTEC is pleased to announce that Out of the Box Manufacturing has purchased an MV-6 OMNI to meet their ongoing commitment to continuous process improvement. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable OBMFG to provide their customers with flawless manufacturing quality and consistent on-time deliveries all at a competitive price!
Industry News | 2020-07-07 13:55:37.0
MIRTEC is pleased to announce that Gentec, a Québec-based design and manufacturing company specializing in rugged and reliable custom-made products and solutions in the fields of high-tech, power and power management electronics, has selected MIRTEC's award-winning MV-3 OMNI Desktop 3D AOI system. The MV-3 OMNI is the perfect 3D Inspection Solution to strengthen Gentec's commitment to uncompromised production quality.
Industry News | 2021-01-17 17:28:43.0
MIRTEC is pleased to announce that VEXOS has selected MIRTEC as their 3D AOI 'Partner of Choice' based on key performance indicators including Inspection Performance, Gage R$&R, Ease of Programming and Customer Support.
Industry News | 2021-05-31 03:37:50.0
MIRTEC is pleased to announce that Dynamic Source Manufacturing, Inc. has selected MIRTEC's MV-6 OMNI 3D AOI machine to meet their high-quality manufacturing standards. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable DSM to achieve 100% customer satisfaction.
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2011-05-16 16:53:28.0
SMTA China announces that it presented eight overall awards, nine best paper/presentation awards and two best exhibit awards at the SMTA China East 2011 Conference Award Presentation Ceremony, held on Thursday, May 12, 2011 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.
Industry News | 2011-01-20 13:45:14.0
IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.
