Electronics Forum | Fri Nov 16 18:07:54 EST 2007 | wayne123
The way that the last two companies that I have worked for do is, as soon as the I.C is programmed it is marked with a either a gray or Yellow sharpie (just a small dot) in addition we always tried to make sure that this dot was at the end of I.C whe
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Mon Jan 21 11:12:20 EST 2008 | davef
Just what is delaminationg during testing? Water washing should be sufficient to clean WS609. On the other hand, it's possible you're conveyor speed is too high to do a good job cleaning the high density areas. What kind of testing have you done to
Electronics Forum | Tue Jan 29 13:51:24 EST 2008 | bbarton
Dave F....BOGUS BOGUS BOGUS What compatability issue could there possibly be if the flux is removed during wash???? Why on EARTH would you leave ANY WS flux residue on the board? A recipie for disaster! Beef up the cleaning process, test for contami
Electronics Forum | Sun Feb 03 16:50:59 EST 2008 | bbarton
Won't argure with you Davef, but guys who suggest totally unnecessary steps to resolve a cleaning problem drive me NUTS!! What would the moulding compound manufacturer have to do with it? HIS BOARD IS NOT CLEAN!! Keep it simple, get the job done! Don
Electronics Forum | Fri Feb 17 16:46:29 EST 2006 | GS
Hi CW, mine is not the answer to your questions, but I suggest you to take a look of the latest level of J-STD-033B (October 2005) The J-STD-033A was from July-2002, and several important points are different from latest level. For instance, in Cha
Electronics Forum | Fri Feb 17 16:50:58 EST 2006 | GS
Hi CW, mine is not the answer to your questions, but I suggest you to take a look of the latest level of J-STD-033B (October 2005) The J-STD-033A was from July-2002, and several important points are different from latest level.For instance, J-
Electronics Forum | Tue Jan 29 19:47:36 EST 2008 | davef
Bruce Barton: We're not intending to suggest that anyone is purposely leaving WS flux residue on the board after cleaning. Fact is, Arun isn't sure if the boards are completely clean. Arun said, "We haven't tested the substrate for cleanliness." Gi
Electronics Forum | Mon Nov 19 18:58:28 EST 2007 | jmelson
On big chips, we use a tape printing device, I think it is a Brother PT1750. We have a small device, though, that is in an SO8 package, and the only thing we've come up with is to scratch a product letter code and the program date with a stylus. Th
Electronics Forum | Fri Apr 21 08:07:10 EDT 2006 | amol_kane
I struggled with the std too, when trying to justify the need for a desiccant cabinet. according to my interpretation: 1. the components are baked at 125 or 150 dec C within 24 hrs of manufacture (this is MET) and sealed in the MBBs at the component
