Electronics Forum | Fri Mar 23 07:39:34 EDT 2007 | namruht
I have tried to teach the part a couple of different ways. I have the component taught as a Quad Flat Pack and I am ignoring two of the sides. This has provided better results but still not consistent.
Electronics Forum | Sun Mar 25 10:53:19 EDT 2007 | barney
Check with your UIC sales if your machine can be upgraded to UPS+ 6.2.2 sofware. They have upgraded the vision system so that it can process these kinds of parts.
Electronics Forum | Mon Apr 02 10:50:39 EDT 2007 | CAN
We have simmilar probelms with a GSM. Lie to it and tell it there are less pins. If there are 6 pins on each side tell it there are 4 and to ingnor the outer 2. then it may miss the dot. Or have it look at just 2 sides like a SOIC.
Electronics Forum | Tue Feb 11 10:59:31 EST 2020 | dontfeedphils
I was going to say, technically it's BTC, so I don't believe it needs a fillet, only evidence of wetting.
Electronics Forum | Tue Feb 11 11:42:06 EST 2020 | slthomas
Yep....I just looked at a copy of IPC-610-G and am not 100% sure but I think it's Note 5, Table 8-16, pg. 8-96.
Electronics Forum | Tue Feb 11 17:04:43 EST 2020 | astarotf
hello robgd3 Thank you for your contribution based on your experience and I see that it is very useful for my case, since it is very similar, we will begin to analyze the points mentioned.
Electronics Forum | Tue Feb 11 17:05:53 EST 2020 | astarotf
Evtimov thank you very much for sharing this profile, we will perform tests with this curve to see behaviors in the oven and pasta.
Electronics Forum | Wed Feb 19 12:30:19 EST 2020 | emeto
Sebas, Curve you attached is using different temp table. We need valid data to evaluate.
Electronics Forum | Wed Aug 09 20:03:22 EDT 2017 | ttheis
We're having problems with Kester pastes (NP545 pb free and EP265 60/40 no clean pastes.) All of our other components reflow just fine with either paste, but for some reason this QFN chip doesn't wick to the QFN's pads well. It seems like some type
Electronics Forum | Wed Nov 14 01:00:20 EST 2007 | reypal
recently, we also have problem with QFN around 3% defect related to soldering. from the cross section it turns out to be solder crack. it could be the paste volume on the center pad is too much causing QFN to float that eventually will cause crack on