Full Site - : qfn thermal pad (Page 3 of 157)

Metcal to Debut New Features on Scorpion Rework System at APEX

Industry News | 2014-03-10 18:35:58.0

Metcal today announced that it will introduce several new features for the Scorpion Rework System during the IPC APEX EXPO.

Metcal

Metcal Receives Award for New Features on Scorpion Rework System

Industry News | 2014-10-01 13:40:18.0

Metcal announces that it was awarded a 2014 Global Technology Award in the category of Rework & Repair for its APR-1200A-SRS-MOB: Metcal Scorpion Rework System, SmartPlace Technology (Mobile) & Automatic Placement Package.

Metcal

Metcal Receives Award for New Features on Scorpion Rework System

Industry News | 2014-10-01 13:41:26.0

Metcal announces that it was awarded a 2014 Global Technology Award in the category of Rework & Repair for its APR-1200A-SRS-MOB: Metcal Scorpion Rework System, SmartPlace Technology (Mobile) & Automatic Placement Package.

Metcal

Metcal to Exhibit Its Leading Technologies at SMTA Guadalajara 2015

Industry News | 2015-10-06 19:29:29.0

Metcal today announced that they plan to exhibit a range of products including the Scorpion, MX-5200, HCT-900 and PCT-100 at table #67 at the upcoming SMTA Expo in Guadalajara, Mexico, which is scheduled to take place October 14-15, 2015, at Riu Hotel in Guadalajara, Mexico.

Metcal

Effective Qualification of Soldering Iron Performance Criteria

Technical Library | 2012-11-27 14:06:48.0

Quality managers and line supervisors are routinely tasked with the responsibility of ensuring that the hand soldering process is under control. The method most commonly used is to measure the idle tip temperature of the soldering station and to use this reading as a benchmark of system compliance. This method, although popular is now being seriously questioned by many industry professionals as being irrelevant in qualifying true system process control. This document aims to present a practical view of what factors are important for successful hand soldering and to suggest an alternative procedure for qualification that is simple, repeatable and directly related to the effectiveness of the soldering station.

Metcal

Hand Soldering with Lead Free Alloys

Technical Library | 2018-02-22 10:56:36.0

As companies start to implement lead free soldering processes, hand soldering and associated techniques have been identified as key functions in the manufacturing process requiring additional research and development. Hand soldering tends to occur at the end of the process line where the circuit board has a high intrinsic value and so correct process control will have a significant affect on manufacturing costs and productivity.This paper discusses the fundamental aspects of the hand soldering process and discusses process adaptation requirements for successful lead free implementation.

Metcal

Surface Mount Rework Techniques

Technical Library | 1999-05-09 12:51:38.0

This Technical Note outlines, step by step, the easiest ways to remove and replace surface mounted devices, using the lowest possible temperatures. This document discusses the following topics: Removal and replacement of discrete and passive components (capacitors, resistors, SOTs), Removal of two-sided components (SOICs, SOJs, TSOPs), Removal of quad components (PLCCs, QFPs), Replacement of quad components including fine-pitched devices.

Metcal

Risk Mitigation in Hand Soldering

Technical Library | 2019-01-02 21:51:49.0

Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.

Metcal

Extending Soldering Iron Tip Life

Technical Library | 1999-05-09 13:05:12.0

This Technical Note discusses the construction of solder tips, the various failure modes associated with tip plating (cracking, wear, corrosion, and dewetting), how to diagnose those failure modes, and specific practices that can be taken to minimize or eliminate each one.

Metcal

SMTA International to Address QFN Assembly & Reliability

Industry News | 2011-09-14 12:04:43.0

The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.

Surface Mount Technology Association (SMTA)


qfn thermal pad searches for Companies, Equipment, Machines, Suppliers & Information