Electronics Forum | Thu Apr 15 17:06:08 EDT 2004 | russ
What are your temps at the locations that you are having trouble with. We cannot tell anything by the zone settings of an oven. We need max temp, how long above liquidous etc.. a lot of times this symptom is due to too long of a soak at too high o
Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith
I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.
Electronics Forum | Wed Feb 21 14:52:36 EST 2007 | wavemasterlarry
Put a wieght on it.
Electronics Forum | Mon Feb 19 07:31:43 EST 2007 | jax
Check the nozzle. If these are the only two parts on the board that use a specific nozzle, it's a good place to start. The nozzle is probably not releasing well and shifting the component when trying to retract after placement...
Electronics Forum | Mon Feb 19 08:38:05 EST 2007 | realchunks
Are your pads on the board aligned correctly? I've seen this a lot lately. Pads on opposite sides are not aligned correctly. This causes the part to twist. If you have the Gerber and a way to check it, it's worth the 3 minutes to check.
Electronics Forum | Tue Feb 20 23:46:38 EST 2007 | Muhammad Haris
hi Jax the nozzle which i am using for these components are also used for large SOPs and other components so i cant blame my nozzles.The problem is, they always shift to some 5 degree plus but some times it place them accurately.
Electronics Forum | Tue Feb 20 18:04:53 EST 2007 | coop
I am not familiar with the YV100XG pick & place but you might want to increase the mount height of these components The double stick tape isn't as thick solder paste. it might be pushing the component too far down causing it to twist. I encountered
Electronics Forum | Fri Aug 20 03:19:22 EDT 1999 | PeterB
| | | | | | One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate conta
Electronics Forum | Wed Aug 21 20:11:34 EDT 2002 | mitch
We are going to begin using a 64 pin 10mm QFP with 0.5mm lead pitch. I was recently asked if we need to purchase our PCB with E3 coating instead of tinned pads when using the .5 pitch. The concept being suggested is that the E3 coating will give us b
Electronics Forum | Wed Aug 01 12:34:12 EDT 2001 | JohnW
The material has to be injected from beneath the component, it's a 240 pin QFP, ideally I wouldn't want the material gong past teh leads as I have to have the option to rework the thing if, perish the thought, it fail's and need's fixed.....
