Electronics Forum: reballing services (Page 3 of 4)

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark

| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

Re: Reballing BGA Devices

Electronics Forum | Fri Jul 09 16:50:25 EDT 1999 | Mark

There is a company named BGA Bumps that reconditions BGA IC's. Check out their web page www.bgabumps.com(below). As far as process specs you should look at the July 1999 issue of Circuits Assembly Magazine detailing many complex rework process and co

Re: Re balling BGA

Electronics Forum | Tue May 26 15:05:39 EDT 1998 | Justin Medernach

| | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | Earl Moon | Earl: We send the BGAs to a service "re-baller." Dave F | | PSI, 16833

Re: Re balling BGA

Electronics Forum | Tue May 26 18:24:05 EDT 1998 | Earl Moon

| | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | Earl Moon | | Earl: We send the BGAs to a service "re-baller." Dave F | | | | P

Re: Re balling BGA

Electronics Forum | Wed May 27 11:13:38 EDT 1998 | Justin Medernach

| | | | I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). | | | | Earl Moon | | | Earl: We send the BGAs to a service "re-baller." Dave F | |

Re: Reballing BGA Devices

Electronics Forum | Wed Jan 14 22:47:24 EST 1998 | Ron Costa

I've had demo's on two machines recently. HTI Engineering in Medfeild MA. has a very nice machine. Singularity in Portsmouth N.H. has a very basic , simple machine. You should check tooling costs. If you would like to talk more about it give me a c

Looking for ball attach capability on panel assembly

Electronics Forum | Wed Aug 19 16:28:03 EDT 2015 | mdeley

Looking for a Santa Clara area contract service with capability to attach 15mil dia. solder coated Cu balls, ideally on a 12" x 18" PI panel, small job to start. T&R services are a plus. My initial search is coming up with device/component level r

Re: Reballing BGA Devices

Electronics Forum | Sun Jan 25 10:39:55 EST 1998 | Rich Breault

| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET

Re: Reballing BGA Devices

Electronics Forum | Sun Jan 25 10:39:52 EST 1998 | Rich Breault

| Does anyone have any information on reballing BGA devices? | I'm looking for specs, a process flow, and what tests | should be performed afterward. | Also, I'm looking for any companies that contract this | service. | Thanks. Hello Allan, We at NET

QFP w/ oxidized leads

Electronics Forum | Thu Mar 28 11:06:49 EST 2002 | Tony Fox

Our company carries out this service for major OEM and CEM's Our web site address is http://www.retronix.co.uk Every device after it has been re-tinned gose throught a vision inspection system were it is inspected for coplinarity etc, we also re-ball


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