Electronics Forum: ref (Page 3 of 15)

Re: ref: tombstoning on chip capacitors

Electronics Forum | Wed Apr 19 08:45:33 EDT 2000 | Mark

THE PROBLEM IS DEFINETLY CAUSED BY INCORRECT PAD DESIGN. A FRIEND DID A INVESTIGATION ON TOMBSTONING AND HAS THE CORRECT SIZES.HE CAN BE E-MAILLED AT NMANSON@AFTE.COOKSON .COM OR TEL. 0094 1355 276 500

Re: ref: tombstoning on chip capacitors

Electronics Forum | Fri Apr 21 14:31:20 EDT 2000 | JACOB LACOURSE

I FOUND THAT ONE OF THE MANY REASONS FOR TOMBSTONING COMPONENTS IS MOISTURE IN SOLDER PASTE. ONE WAY TO CONFIRM THIS IS TO CHECK FOR EXCESIVE SOLDER BALLS AROUND THE PART IF THEY ARE PRESENT THEN YOU MAY HAVE A HUMIDITY PROBLEM. GOOD LUCK!!! JAKE

Polyamide

Electronics Forum | Mon Feb 15 14:30:00 EST 1999 | Dave Turner

| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc

FR4 vs Polyamide

Electronics Forum | Mon Feb 15 14:28:09 EST 1999 | Andy Bellworthy

Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc

Re: FR4 vs Polyamide

Electronics Forum | Tue Feb 16 12:26:07 EST 1999 | S. Rose

| Any info on the pros and cons of FR4 or Polyamide ref the use of soldering PGAs would be helpful. ie. temp co-efficient diffs, baking, wave soldering, Convection reflow etc |

Reflow Specs.

Electronics Forum | Tue Aug 14 21:29:29 EDT 2001 | mugen

Hi, Just to clarify the terms, traditional : aka : Ramp-Soak-Spike (RSS) profiling method tent : aka : Ramp-To-Spike (RTS) profiling method By search engines (eg. Yahoo), you can find more example profiles for your ref.

Cpk Variables Control for Paste Printing

Electronics Forum | Thu Apr 04 03:20:59 EST 2002 | ianchan

Good points... Thanks everyone. ref back to Mr.Bob's/Dave's observation (not in order) on brick accuracy, position & placement, Stencil apperture geometrical opening, will feedback to my team to brain-storm further.

Switching to 62/36/2

Electronics Forum | Thu Oct 16 18:22:40 EDT 2003 | Gabriele

Russ, you are right, I've seen briging on 16 mils pitch on OSP (ref under N2),to avoid it needs more care in paste volume. Easier was by 63/37 (Clean) and N2 (on OSP double sided PBA). Regards Gabe

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Sat Apr 10 09:24:44 EDT 2004 | ccl

u are right, Dave, AUS 5 is a LPISM paste. Thanks a lot for the advise and ref. given. rgd ccl

Conveyors

Electronics Forum | Thu May 20 12:05:12 EDT 2004 | Rob

I got one sitting in my room that is not being used. It meets SMEMA standards and is from Conveyor Technologies Model# REF-CC-1M-1-BR. If you are interested, I can put you in contact with someone who can talk with you...


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