Electronics Forum | Tue Sep 02 09:09:11 EDT 2008 | allan99
Good morning everybody! I'd like to receive from you articles or tutorial links teaching how to develop a reflow profile and its process variants, I'm a new user from SMTnet forum and I can see profesional with grate knowledgment. thanks in advance
Electronics Forum | Tue Sep 02 13:30:11 EDT 2008 | hermes
Try this. Basic reflow profile build up and explanation of its parts: ramp-up, soak or no soak, peak, cooling. Good starting point.
Electronics Forum | Thu Jun 16 22:18:35 EDT 2005 | davef
Cooling may require muff fans positioned over that output conveyor of the oven.
Electronics Forum | Tue Jun 21 12:32:50 EDT 2005 | GS
Darby and Dave, many thanks. Regards GS
Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin
please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Mon Dec 04 15:37:51 EST 2000 | blnorman
Out of curiosity, what flavor lead-free paste were you using? That's also going to affect the profile.
Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef
Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.
Electronics Forum | Mon Dec 04 20:30:40 EST 2000 | Michael Parker
Flavor???? I have always been partial to Wintergreen, but be sure to get it with the Tarter Control for cleaner apertures and baking soda for a brighter finish
Electronics Forum | Tue Jun 14 17:01:18 EDT 2005 | peter ng
It's impossible to do so.The cooling phase is important to perform the strength of the solder joint.Without this phase,the good solderbility will not able to achieved.
