Electronics Forum: rohs bga (Page 3 of 13)

BGA Voiding for RoHS

Electronics Forum | Mon Nov 16 13:33:31 EST 2009 | CL

Thank you for your responces. Chris

ROHS replacment parts

Electronics Forum | Tue Jun 09 10:21:30 EDT 2009 | c111

We have had issues for the last 4-5 years with converting our stock from leaded to ROHS components. We are a CM and have customers who want all ROHS and some that are still leaded. The problems we run into are when we intrduce a new ROHS component wh

RoHS BGA stencil question

Electronics Forum | Thu Feb 08 08:28:11 EST 2007 | mzaboogie

Good Morning Everyone, We have an application coming up with several BGA's on a RoHS assembly. One is a 25 mil ball on a 40 mil pitch, another is a 15 mil ball on a 40 mil pitch. In the past for leaded assemblies, we have used square apertures for 1

Oop's Pb BGA's in a RoHS process?

Electronics Forum | Fri Jun 16 15:05:29 EDT 2006 | grantp

Hi, We ran some boards and the girl on the line put in some Pb BGA's instead of using RoHS parts. This should not have happened as we have almost no Pb parts left, and we spray painted Pb parts fluorescent pink so it was obvious. The boards seem t

BGA soldering problems

Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

BGA soldering Problem

Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones

I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen

A BGA reports (RoHS related of course)

Electronics Forum | Fri Feb 09 10:00:12 EST 2007 | patrickbruneel

Interesting BGA saga http://www.emsnow.com/npps/story.cfm?ID=24434 To be continued Patrick

Using RoHS Components in a leaded paste world

Electronics Forum | Thu Oct 31 12:37:37 EDT 2013 | pbarton

You should have no difficulty with QFN or QFP parts when using non-RoHS solder. The QFP's are most likely to have tin plated leads and the metallisation on the QFN lands the same, or ENIG. Check the component part datasheets to verify the plating an

BGA Voiding for RoHS

Electronics Forum | Tue Nov 10 07:37:32 EST 2009 | scottp

I'm curious why your customer is concerned with BGA voiding. Normal process voids, even well in excess of IPC "limits", don't effect reliability so why monkey with the process to get rid of a non-issue?

BGA Voiding for RoHS

Electronics Forum | Mon Nov 16 03:31:22 EST 2009 | cunningham

I suggest you X-Ray the devices before you place them on the board we have just foun a large amount of voids on the BGA before its even placed


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