Electronics Forum: seal and copper and layers (Page 3 of 3)

Pick and Place Startup - LQPF100 bridging issues

Electronics Forum | Fri Mar 26 15:48:31 EDT 2021 | grahamcooper22

Leaded HASL on small pads can be quite difficult to print on...the HASL tends to be domed rather than flat..and that can affect print quality...you really need a perfectly flat pcb pad to print paste on when you are assembling 0.5mm QFPs. If the pcb

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines

Electronics Forum | Mon Apr 09 02:57:16 EDT 2018 | robl

Hi, these are both power pins, usually connected to a dedicated inner VDD/VDDQ 1oz copper layer, making a very effective heatsink. I am guessing that not enough heat got to the ball to fully melt it, creating a weaker column rather than a beautifull

Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Mon Apr 17 19:42:34 EDT 2000 | Russ Cutler

We just bought a new Heller 1800 EXL reflow oven for reflowing SMT boards. We us a low temp RMA solder paste with 2% silver. Everything we build is to IPC Class 3 specifications. We have approximately 600 different types of circuit boards we build

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