Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Wed Jan 14 08:28:46 EST 2004 | davef
Search the fine SMTnet Archives for background on solder on gold fingers. As we recall: * Paste selection * Proper reflow recipe tuning ... are important.
Electronics Forum | Thu Apr 05 12:25:01 EDT 2001 | davef
Talk about bucking the trend!!! OK, OK, I know some US military work still requires RMA. You�re both correct. Cleaning decisions for RMA fluxed boards are based on customers requirements. [Some do (clean) and some don�t.] Older US military speci
Electronics Forum | Thu Apr 20 08:49:08 EDT 2006 | Chunks
a) Is there a recommended dip or dwell time for the dip soldering? Check your data sheet for the part. Dwell time is everything in selective soldering. Top side wetting is a good process indicator. b) How do we improve the solder coverage in the
Electronics Forum | Wed Apr 26 10:21:09 EDT 2006 | slaine
Hi you need to dip long enough for the temperature of the part being soldered to reach about 20 degrees above liquidus of the solder. For the small parts we dip solder we had Sn62 and SAC387 baths set to 250 degrees and this seems to work best for us
Electronics Forum | Wed Apr 19 04:41:42 EDT 2006 | ge_lim
Hi I am using selective soldering to dip soldering the connector pins to the PCB and would like to know your experience: a) Is there a recommended dip or dwell time for the dip soldering? b) How do we improve the solder coverage in the TH? c) How t
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 16:59:44 EST 2000 | Dave F
Robert: Expect a 0.033" raw ball to be within 0.022" of the pad, after reflow. To be clear, that�s not a matter of shrinking by 33%. The volume of solder on the pad is the same as the volume of solder in the raw ball. It�s just that the solder is
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
Electronics Forum | Wed Mar 01 10:46:26 EST 2000 | Robert Hartmann
Kelvin, Thanks for the help. The actual opening size is .440 mm, but I think what you said makes sense. After discussing with the customer, it looks like it is the height which matters, more than the diameter. We have learned that the height of t
