Electronics Forum | Mon Aug 13 21:04:15 EDT 2001 | davef
What??? You don�t have enough things to monitor? The origin of some profiles is mysterious. It�s probably good to try to understand such mysteries. Certainly, the important determinants in the design of your reflow profile are: * Paste you�ve sel
Electronics Forum | Wed Jul 14 13:10:49 EDT 1999 | Earl Moon
| I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run it
Electronics Forum | Mon Dec 04 21:42:12 EST 2006 | KEN
Keep in mind that device pitch, pad geometry, lead length and even alloy type will play a roll in your evaluation. I have an assembly that we run 10k pieces per month. One two-pin connector has a pitch of 1.27mm. Unfortunately, the pads are 0.007"
Electronics Forum | Fri Jun 12 23:52:42 EDT 2015 | armandogomez
Reflow? or Wave solder? or selective wave solder? For what I understand you problems is with the preheaters you have a high temp that dries up the flux, and when hits the wave is doing that, do you have a thermal profiler? what's the temp just befor
Electronics Forum | Mon Apr 01 05:55:54 EST 2002 | nifhail
Anyone with selective wave experience ? I'm buying the Selective Wave machine and trying to workout the comparison matrix. Can someone tell me what criteria should I look at when listing down the matrix ?...things like, min clearance to the high prof
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Wed Oct 27 11:38:44 EDT 2004 | marc
This has always been a big debate on what is better. Few things to consider before getting into number of zones. What is the throughput and cooling requirements? Throughput is a direct relation to length of heating zone. Longer heating length
Electronics Forum | Tue Aug 22 13:05:32 EDT 2006 | Board House
Hi CP, From a PCB manufacturing side, all of our product is Lead free / RoHs compliant if it has a surface finish other than Hot Air. To be ROHS compliant and Able to with stand Lead Free Assembly, this is where the board house would need to switch
Electronics Forum | Tue Dec 24 11:01:19 EST 2013 | davef
I wouldn't get too tightly wrapped around the axial of paste suppliers recommendations of thermal recipes. Said another way, "Do not count on the solder paste representatives for good technical advice--they are the ones who came up with these "'TIME
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