Electronics Forum: self (Page 3 of 39)

Self Tensioning Frames

Electronics Forum | Tue Jan 28 07:33:59 EST 2020 | stephendo

Why not get stencils in frames? I think that is how most of us do it.

Self Tensioning Frames

Electronics Forum | Wed Jan 29 10:01:24 EST 2020 | dontfeedphils

Oh yea, space savers. I switched from those to VG lol. Still prefer VG.

Part Rework stencils

Electronics Forum | Mon Feb 14 21:28:08 EST 2022 | dwl

What about katpon? One per use only, but it will self adhere to the PCB.

Re: Gold Immersion - Soft Joints

Electronics Forum | Mon Oct 25 21:28:38 EDT 1999 | Dave F

3%) concentrations of gold form brittle intermetallic compounds with the tin in your solder. Electroless gold is applied with an autocatalytic process that self-limits around 5 mils thickness. You're correct electrolytic gold is used for goldfinger

Pick & Place Recommendation

Electronics Forum | Mon Dec 15 11:15:58 EST 2008 | evtimov

Split, I beleave there is no machine on the world, which could meat your requirments. But if you find one, please tell me the brand so I can buy plenty of them. If not check your requirments again: -no maintanance -very easy to program(self-progra

Manually Adjusting Misplaced SMT Components

Electronics Forum | Fri May 15 08:18:17 EDT 2015 | emeto

We all agree that you need to have your machine fixed. It probably needs calibration. Using Lead paste will help the parts to self align in the oven - however your misplacement should cover at least 50% of your pad. Pb free paste will not self align

BGA Assembly Misalignment

Electronics Forum | Tue May 22 17:21:43 EDT 2001 | davef

BGA require placement accuracy of only 0.3mm (�12 thou), compared with a required placement accuracy of 0.08mm (�3 thou) for fine pitch devices. Even with this level of misalignment, plastic BGA self-center / self-correct during reflow due to symmetr

Larger lands in corners

Electronics Forum | Mon Jan 14 22:52:48 EST 2008 | davef

Using larger pads on the corners is fairly common to improve self-alignment of BGA and CSP. For example, "9.3.2.8 Large corner pads and overprint The self-alignment of BGA or CSP can be improved through a design change. By utilizing a large board pad

Heat sinking delicate leaded parts

Electronics Forum | Tue Feb 15 19:54:48 EST 2000 | Clarissa Ortner

I am supposed to heatsink a Temp sensor with leads .9-1.1mm(.035--43"). I have found on our engineering units that the smallest heat sink I have found commercially is still too heavy for the leads and unless the operators use exxxxtreme care the wei

Re: Remote Camera Box for QUAD lllc/IVc

Electronics Forum | Tue Jun 20 08:04:42 EDT 2000 | NIck

Hermie, The Camera is made by Sony and unfortunatly you can't just get the Box by it self they come as a matched set from the manafacter. If you could find a box by it self (second hand)its a hit or miss deal. Now the real bad news Sony is stopping


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